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Special Issue "Selected Papers from TENCON 2018"

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Internet of Things".

Deadline for manuscript submissions: 31 January 2019

Special Issue Editors

Guest Editor
Prof. Dr. Kukjin Chun

Seoul National University, Korea
Website | E-Mail
Interests: sensor; MEMS
Guest Editor
Prof. Dr. Changhyun Kim

Research Professor, Dept. of Creative IT Engineering, POSTECH, Korea
Website | E-Mail
Interests: passive/active neural probe design and fabrication for bio-medical applications; high speed memory design; architecture and process technology; new emerging memory development; product planning of memory; electronic components and connectivity modules
Guest Editor
Prof. Dr. Jong Chang Yi

Hongik University, Korea
Website | E-Mail
Interests: quantum and optical electronics
Guest Editor
Prof. Dr. Cheon Won Choi

Dankook University, Korea
Website | E-Mail
Interests: ad hoc sensor networks; energy harvesting sensor networks; medium access control; queueing theory; game theory

Special Issue Information

Dear Colleagues,

TENCON is a premier conference of IEEE Region 10. IEEE TENCON 2018 will be held at Jeju Island, Korea, from 28–31 October, 2018 (http://tencon2018.org/). Traditionally, TENCONs have encompassed all areas in electrical and electronics engineering, as well as information technologies. Recently, advances in sensor technologies have had a remarkable influence on TENCON; sensors and their applications now stand out as notable topics in every area of TENCON, which includes materials, devices, communications, signal processing, and computing. While following the tradition of previous TENCONs, TENCON 2018 will provide a place to deeply discuss the infrastructure that leads to “smartness everywhere”. In such a place, we expect that highly valuable research works will be presented on sensors, sensor networks, and their applications.

This Special Issue selects excellent papers from IEEE TENCON 2018 and covers sensors, sensor networks and their applications, e.g., IoT. Authors of outstanding papers at TENCON 2018, which are related to sensors, sensor networks and their applications, will be invited to submit extended versions of their works to this Special Issue for publication.

Potential topics include, but are not limited to

  • IoT
  • IoT based smart cities
  • Ad hoc sensor networks
  • Energy harvesting sensor networks
  • Sensor device structure
  • Advanced sensor materials

Prof. Dr. Kukjin Chun
Prof. Dr. Changhyun Kim
Prof. Dr. Jong Chang Yi
Prof. Dr. Cheon Won Choi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
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