Micromachined Devices for Microwave Signal Processing

Dear Colleagues, 

Microsystem technology designed for high-frequency applications has become a well-established research domain focusing on many microwave-to-millimeter wave devices and subsystems. Applications encompass ground and space architectures for signal routing, including (i) phase shifters in RADAR systems, radio-link communications, satellite reconfiguration, and redundancy logic by RF MEMS switches; (ii) membrane-supported sensing; and (iii) material science probes.

Over the past two decades, micromachining techniques have contributed to technological solutions for manufacturing different types of high-frequency devices based on membrane-supported filters and antennas, RF MEMS switches, probes for material science, and micromachined magnetically coupled structures, just to mention a few applications.

The main advantage of using micromachining is that it is intended to produce structures suitable for high-performance microwave-to-millimeter wave signal processing. Physical (such as RIE, plasma, or LASER) and chemical (such as KOH or TMAH) etching can shape 3D structures and remove sacrificial layers. These techniques are applied in manufacturing devices hosted on substrates typically used in microelectronic applications such as silicon, GaAs, GaN, alumina, and more.

Open questions for all these applications are the compatibility between the etching techniques and the materials used, the lifetime of RF MEMS switches, or potential harsh environment utilization.

For this Special Issue, we welcome research papers, communications, and review article contributions describing the state-of-the-art design, technology, and applications for high-frequency microsystems developed by micromachining techniques.

Dr. Romolo Marcelli
Dr. Emanuela Proietti
Guest Editors

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