Conferences

18–20 October 2016, San Jose, CA, USA
The 13th International Wafer-Level Packaging Conference

Interconnecting Wafer-Level packaging, 3D, and MEMS, the International Wafer-Level Packaging Conference (IWLPC) has been at the forefront of packaging technology evolution; it is one of the premier packaging conferences. Attendees from over 16 countries gather in the heart of Silicon Valley to attend IWLPC to enrich themselves on the latest technology and business trends. Going into its 13th year the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry and SMTA, the distinguished global association in electronic assembly and manufacturing.

http://www.iwlpc.com/

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