Special Issue "Advances in Functionally Graded Materials"

Guest Editor
Prof. Dr. Zengtao Chen
Department of Mechanical Engineering, University of New Brunswick, 15 Dineen Drive, Fredericton, NB, Canada
Website: http://www.unb.ca/ME/faculty/chen.html
E-Mail: ztchen@unb.ca
Phone: +506 458-7784
Fax: +506 453-5025

Dear Colleagues,

New metallurgy techniques make it possible to devise material structures. Particularly, material properties can be designed to vary continuously along structural geometry to prevent delamination and stress concentration in traditional multilayered structures. This will make so called functionally graded materials. Although they were first invented to be utilized as a thermal shield to sustain very high temperature gradients in thin structures, Functionally graded materials are currently being used for many other applications such as wear-resistant linings, heat exchanger tubes, thermoelectric generators, heat-engine components, and in some prostheses. In recent years, materials scientists are developing sophisticated methodologies to fabricate new functionally graded materials for emerging applications, while mechanical engineers and mechanicians are investigating the physical behaviour of these materials to push the application boundary of these materials. Functionally graded materials have been used in microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) under multiple physical fields such as electromagnetic fields, high frequency vibrations, and thermal shocks.

This special issue of Materials will focus on recent advances in functionally graded materials. Realizing the importance of integration of the research efforts in materials science and mechanical engineering to the further development of functionally graded materials, the objective of this issue is to provide a platform for materials scientists and mechanical engineers to share their research ideas and showcase their achievements in the general area of functionally graded materials.

Prof. Dr. Zengtao Chen
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs).

• functionally graded materials
• smart materials and structures
• micro-constituents
• composite materials
• multifield behavior
• manufacturing engineering
• structural integrity
• thermoelasticity
• piezoelectricity
• electromagnetic materials