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The Microstructures and Advanced Functional Properties of Thin Films

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 20 November 2024 | Viewed by 380

Special Issue Editors

State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China
Interests: physical vapor deposition of thin films; oxide and nitride nanocomposites; metal matrix composites; multi-scale characterization and modeling
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Guest Editor
Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588, USA
Interests: light-weight structural materials; high strength/ductile materials; radiation-damage tolerant materials; multi-principal elements and/or multiphase alloys; metal-based and ceramic-based composites
Special Issues, Collections and Topics in MDPI journals

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Guest Editor Assistant
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Interests: chemical and physical vapor deposition of thin films; electrical properties; graphene; metallic composites; electronic behaviors

Special Issue Information

Dear Colleagues,

Due to the rapid development of highly integrated microelectronics and optoelectronic devices over the past several years, the demand and properties required for functional thin films for use in related fields have gradually increased, such as transparent conductive films, heat dissipation films, electromagnetic shielding films, optical films, and so on. Owing to its high efficiency and controllability, vapor deposition, including chemical vapor deposition and physical vapor deposition, has been a major technology used for the synthesis of thin films. During the deposition process, the kinetic and thermodynamic characteristics of atoms effectively influence the microstructures of the films, such as grain size, grain orientation, surface roughness, component distribution, and so on. The intrinsic properties and internal microstructures of thin film materials directly determine their functional performance. Therefore, the unique design of materials and the relationship between the deposition process and the microstructure and functional performance of the thin films are fundamental to promoting the development of advanced functional thin films and their relative applications in the future.

This Special Issue invites the submission of original research or review articles focused on the use of advanced functional thin films within the optical, thermal, and electrical fields. Topics of interest include, but are not limited to, the growth and fabrication of thin films through vapor deposition, the microstructure and unique design strategies employed, and the advanced functional properties exhibited by these thin films.

Dr. Yue Liu
Prof. Dr. Jian Wang
Guest Editors

Dr. Jiamiao Ni
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • deposition
  • microstructure
  • electrical properties
  • thermal properties
  • optical properties
  • thin film growth
  • functional thin film applications

Published Papers (1 paper)

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Research

16 pages, 5021 KiB  
Article
Turning Non-Sticking Surface into Sticky Surface: Correlation between Surface Topography and Contact Angle Hysteresis
by Jingyuan Bai, Xuejiao Wang, Meilin Zhang, Zhou Yang and Jin Zhang
Materials 2024, 17(9), 2006; https://doi.org/10.3390/ma17092006 - 25 Apr 2024
Viewed by 270
Abstract
We present a surface modification technique that turns CuNi foam films with a high contact angle and non-sticking property into a sticky surface. By decorating with mesh-like biaxially oriented polypropylene (BOPP) and adjusting the surface parameters, the surface exhibits water-retaining capability even when [...] Read more.
We present a surface modification technique that turns CuNi foam films with a high contact angle and non-sticking property into a sticky surface. By decorating with mesh-like biaxially oriented polypropylene (BOPP) and adjusting the surface parameters, the surface exhibits water-retaining capability even when being held upside down. The wetting transition process of droplets falling on its surface were systematically studied using the finite element simulation method. It is found that the liquid filled the surface microstructure and curvy three-phase contact line. Moreover, we experimentally demonstrated that this surface can be further applied to capture underwater air bubbles. Full article
(This article belongs to the Special Issue The Microstructures and Advanced Functional Properties of Thin Films)
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