Next Article in Journal / Special Issue
Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology
Previous Article in Journal
Acknowledgement to Reviewers of the Journal of Low Power Electronics and Applications in 2013
J. Low Power Electron. Appl. 2014, 4(2), 65-76; doi:10.3390/jlpea4020065
Review

Ultralow-Power SOTB CMOS Technology Operating Down to 0.4 V

1,* , 1
, 1
, 1
, 1
, 1
, 1
, 2
, 3
 and 3
1 Low-Power Electronics Association & Project, Tsukuba, Ibaraki 305-8569, Japan 2 Department of Engineering Science, Graduate School of Informatics and Engineering Departments, The University of Electro-Communications, Chofu, Tokyo 182-8585, Japan 3 Institute of Industrial Science, The University of Tokyo, Meguro, Tokyo 153-8505, Japan
This article is based on “Vmin = 0.4 V LSIs are the real with Silicon-on-Thin-Buried-Oxide (SOTB)—How is the application with ‘Perpetuum-Mobile’ micro-controller with SOTB?”, which appeared in Proceedings of the IEEE 2013 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ©2013 IEEE.
* Author to whom correspondence should be addressed.
Received: 27 February 2014 / Revised: 7 April 2014 / Accepted: 10 April 2014 / Published: 24 April 2014
(This article belongs to the Special Issue Selected Papers from IEEE S3S Conference 2013)
View Full-Text   |   Download PDF [441 KB, uploaded 24 April 2014]   |   Browse Figures

Abstract

Ultralow-voltage (ULV) CMOS will be a core building block of highly energy efficient electronics. Although the operation at the minimum energy point (MEP) is effective for ULP CMOS circuits, its slow operation speed often means that it is not used in many applications. The silicon-on-thin-buried-oxide (SOTB) CMOS is a strong candidate for the ultralow-power (ULP) electronics because of its small variability and back-bias control. Proper power and performance optimization with adaptive Vth control taking advantage of SOTB’s features can achieve the ULP operation with acceptably high speed and low leakage. This paper describes our results on the ULV operation of logic circuits (CPU, SRAM, ring oscillator and other logic circuits) and shows that the operation speed is now sufficiently high for many ULP applications. The “Perpetuum-Mobile” micro-controllers operating down to 0.4 V or lower are expected to be implemented in a huge number of electronic devices in the internet-of-things (IoT) era.
Keywords: ultralow power; ultralow voltage; CMOS; minimum energy point; variability; back bias; FDSOI; silicon-on-thin-buried-oxide (SOTB); thin BOX ultralow power; ultralow voltage; CMOS; minimum energy point; variability; back bias; FDSOI; silicon-on-thin-buried-oxide (SOTB); thin BOX
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Share & Cite This Article

Export to BibTeX |
EndNote


MDPI and ACS Style

Sugii, N.; Yamamoto, Y.; Makiyama, H.; Yamashita, T.; Oda, H.; Kamohara, S.; Yamaguchi, Y.; Ishibashi, K.; Mizutani, T.; Hiramoto, T. Ultralow-Power SOTB CMOS Technology Operating Down to 0.4 V. J. Low Power Electron. Appl. 2014, 4, 65-76.

View more citation formats

Article Metrics

Comments

Citing Articles

[Return to top]
J. Low Power Electron. Appl. EISSN 2079-9268 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert