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Journal: Micromachines, 2018
Volume: 9
Number: 436

Article: Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating
Authors: by Jörg Scholvin, Anthony Zorzos, Justin Kinney, Jacob Bernstein, Caroline Moore-Kochlacs, Nancy Kopell, Clifton Fonstad and Edward S. Boyden
Link: https://www.mdpi.com/2072-666X/9/9/436

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