Special Issue "Technology and Applications of Carbon-Based MEMS"

Guest Editor
Prof. Dr. Dean M. Aslam
Electrical and Computer Engineering Department, 2120 EB, Michigan State University, E. Lansing, MI 48824, USA
Website: http://www.egr.msu.edu/~aslam/
E-Mail: aslam@msu.edu
Phone: +1 517 353 6329
Fax: +1 517 353 1980
Interests: neural studies using microprobes; biochemical nanosensors; polycrystalline diamond (poly-C) sensors and MEMS (Bio; RF; Packaging); hands-on Lego-robotics modules for K-12; UG and graduate teaching

Dear Colleagues,

Among the known living systems, why is there none without carbon? This might be due carbon’s ability to offer three types of hybrid C-C bonds; sp³ (responsible for diamond lattice), sp² (found in graphite and carbon nanotubes) and sp. An amorphous material called diamond like carbon (DLC) contains both sp³ and sp² bonds. All carbon-based materials offer a unique (a) combination of properties and (b) range of structures not offered by any other known material. This makes them ideal materials for MEMS and NEMS. The challenge is to develop a technology of these materials for new applications not possible with existing materials. The research in the last 20 years has made a remarkable progress leading to BioMEMS, RFMEMS, MEMS packaging and carbon nanotube structures.
The special issue on ‘technology and applications of carbon-based MEMS’ is expected to bring cutting edge research on this subject in one volume for the first time. It will also be a useful resource for existing researchers, new researchers and all those who are interested in carbon’s remarkable current and potential applications.

Prof. Dr. Dean M. Aslam
Guest Editor

Paper submission is requested in the following areas:

Technology: CVD diamond film fabrication for MEMS, dry etching, doping, novel multilayer structures, DLC films, carbon nanotubes (CNT), structures using diamond and CNT or diamond and DLC, nanocrystalline diamond (NCD).

Applications: Diamond-based MEMS, RFMEMS, BioMEMS, optical MEMS, MEMS packaging, radiation detectors, field emission devices, MOS transistors, microfluidics, CNT- & DLC-based MEMS/NEMS, BioMEMS, RFMEMS, NCD based structures.

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed Open Access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 300 CHF (Swiss Francs). English correction and/or formatting fees of 250 CHF (Swiss Francs) will be charged in certain cases for those articles accepted for publication that require extensive additional formatting and/or English corrections.