Deformation and Fracture of Metal Thin Films
This special issue belongs to the section "Metal Failure Analysis".
Special Issue Information
Dear Colleagues,
Metal thin films have received widespread attention in various frontier research fields, such as flexible electronic devices, integrated circuits, photocatalysis, electro-catalysis, lithium batteries, aqueous zinc batteries, and solar cells. However, deformation and fracture are familiar phenomena when processes of metal thin films are prepared and used.
Therefore, this Special Issue on the deformation and fracture of metal thin films will be published in the journal Metals. This Special Issue covers all aspects of studies on the deformation and fracture model, the deformation and fracture mechanism, the deformation and fracture feature, the deformation and fracture process, the influence factor and method of improvement, and displays from both exprimental or/and theoretical viewpoints.
Dr. Fan Jiang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- metal thin films
- deformation
- fracture
- model
- mechanism
- process
- feature
- influence factor
- prevention method
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Published Papers
Metals - ISSN 2075-4701