Design and Integration of Flexible Electronic Materials/Devices
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: closed (20 March 2023) | Viewed by 260
Special Issue Editors
Interests: flexible electronic devices and system integration; transient electronics and intergration; novel thin-film solar cells; wide bandgap semiconductor materials and power devices
Special Issues, Collections and Topics in MDPI journals
Interests: organic and perovskite materials and photovoltaic devices; nitride semiconductor materials and power devices; flexible electronic devices and intergration
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Flexible electronics have been actuated from the continuous development and progress in thin-film materials and devices. These advances have been further boosted by new integration strategies that enable the realizing of bendable, printable, stretchable, and low-cost electronic devices over large areas. Over recent decades, flexible electronics have facilitated much of the technological innovation in the fields of transistors, LEDs, sensors, solar cells, substrates and functional materials, which have found applications on flexible displays, e-paper, RFID, solar cells, senor arrays, biochips, and so on. This Special Issue focuses on the development of design and integration of flexible electronic devices, covers the main topics of (but is not limited to) new material theory and models, device structure and interface design, material preparations and device fabrications, device integrations and circuits, device testing and physical analysis, and large-area manufacturing processes. Work on subjects other than the aforementioned that contribute to advancing knowledge of flexible electronics and their applications are also welcome in this Special Issue.
Prof. Dr. Chunfu Zhang
Dr. Dazheng Chen
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- flexible electronics devices
- flexible electronics materials
- new theory and model
- device design and fabrication
- device integration
- device application
- test techniques and analysis method
- flexible functional materials
