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Energies
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Thermal Management and Characterization in Electronics
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Thermal Management and Characterization in Electronics

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: closed (1 July 2021) | Viewed by 3908

Special Issue Editors

Prof. Andras Poppe

E-Mail Website
Guest Editor
Department of Electron Devices, Budapest University of Technology and Economics; Magyar tudósok körútja 2, bldg. Q, 1117 Budapest, Hungary
Interests: LED testing; thermal simulation; electro-thermal simulation; logi-thermal simulation; multi-domain modeling
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Márta Rencz

E-Mail Website
Guest Editor
Department of Electron Devices, Budapest University of Technology and Economics, H-1117 Budapest, Hungary
Interests: thermal investigation of ICs and MEMS; thermal sensors; thermal testing; thermal simulation; thermal model generation; electro-thermal simulation; CPS systems
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Lorenzo Codecasa

E-Mail Website1 Website2
Guest Editor
Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, Italy
Interests: electric engineering; electro-thermal circuit modeling and simulation; electromagnetic simulation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

As a follow-up to the 26th THERMINIC Workshop, held in Berlin in September 2020, a Special Issue of energies about thermal and multi-physical investigations electronics systems will be edited by Prof. Marta Rencz, Prof. Lorenzo Codecasa and Prof. Andras Poppe.

This Special Issue will target the presentation of the newest research results of thermal effects in electronics today, from characterization to through multi-physics simulation to cooling solutions and reliability assessment.

This special issue is not only collecting papers from the 26th THERMINIC Workshop, but also will containing papers from other scholars who interested in this topic. Papers that were presented at THERMINIC must be revised and contain at least 60% new material that has never been presented before.

Prof. Andras Poppe
Prof. Dr. Márta Rencz
Prof. Lorenzo Codecasa
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multi physics simulation and field coupling
  • thermal modelling and investigation of packages
  • thermal interface materials and their characterization
  • thermal management and characterization of electronic components and systems
  • high temperature electronics
  • thermal issues in power electronics
  • thermal issues in solid state lighting
  • CFD modelling and benchmarking
  • thermal performance of interconnects
  • electro-thermal interactions
  • temperature mapping
  • 3D integration and cooling concepts
  • thermo-mechanical reliability
  • lifetime modelling and prediction
  • prognostics and health monitoring

Published Papers (2 papers)

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Research

14 pages, 2382 KiB  
Article
Application of Scattering Parameters to DPL Time-Lag Parameter Estimation at Nanoscale in Modern Integration Circuit Structures
by Mariusz Zubert, Zbigniew Kulesza, Mariusz Jankowski and Andrzej Napieralski
Energies 2021, 14(15), 4425; https://doi.org/10.3390/en14154425 - 22 Jul 2021
Cited by 1 | Viewed by 1630
Abstract
This paper presents the methodology of material parameters’ estimation for the dual-phase-lag (DPL) model at the nanoscale in modern integration circuit (IC) structures. The analyses and measurements performed were used in the unique dedicated micro-electro-mechanical system (MEMS) test structure. The electric and thermal [...] Read more.
This paper presents the methodology of material parameters’ estimation for the dual-phase-lag (DPL) model at the nanoscale in modern integration circuit (IC) structures. The analyses and measurements performed were used in the unique dedicated micro-electro-mechanical system (MEMS) test structure. The electric and thermal domain of this structure was analysed. Finally, the silicon dioxide (SiO2) temperature time-lag estimation procedure is presented based on the scattering parameters measured by a vector network analyser for the considered MEMS structure together with the 2-omega method. The proposed methodology has the ability to estimate the time-lag parameter with high accuracy and is also suitable for the temperature time-lag estimation for other manufacturing process technologies of ICs and other insulation materials used for integrated circuits such as silicon nitride (Si3N4), titanium nitride (TiN), and hafnium dioxide (HfO2). Full article
(This article belongs to the Special Issue Thermal Management and Characterization in Electronics)
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14 pages, 4317 KiB  
Article
Thermal Resistance Matrix Extraction from Finite-Element Analysis for High-Frequency Magnetic Components
by Guillermo Salinas, Juan A. Serrano-Vargas, Javier Muñoz-Antón and Pedro Alou
Energies 2021, 14(11), 3075; https://doi.org/10.3390/en14113075 - 25 May 2021
Cited by 5 | Viewed by 1709
Abstract
The thermal management of magnetic components for power electronics is crucial to ensure their reliability. However, conventional thermal models for magnetic components are known to have either poor accuracy or excessive complexity. Contrary to these models, the use of Thermal Resistance Matrices is [...] Read more.
The thermal management of magnetic components for power electronics is crucial to ensure their reliability. However, conventional thermal models for magnetic components are known to have either poor accuracy or excessive complexity. Contrary to these models, the use of Thermal Resistance Matrices is proposed in this paper instead, which combine both accuracy and simplicity. They are usually used to characterize semiconductor devices, but not for magnetic components. The guidelines to apply Thermal Resistance Matrices for magnetic components are discussed in detail. The accuracy of this model is validated by 3D FEA simulations and experimental results, showing an absolute error lower than 5 ∘C and a relative error between −6.4% and 3.9%, which is outstanding compared to the carried-out literature review. Full article
(This article belongs to the Special Issue Thermal Management and Characterization in Electronics)
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