Skip to Content

Advancement in Additive Manufacturing and Signal Interference Detection in Communication Network

This special issue belongs to the section "Circuit and Signal Processing".

Special Issue Information

Keywords

  • advancement in 5G/B5G/6G technologies
  • network termination devices management and signal intensity level
  • satellite communication path and signal tracing in slant path
  • utilization of 3D printed surfaces to detect the error margin
  • characterization of novel materials
  • use of filaments, resin to realize the complex geometrical surfaces
  • ulization of metal 3D printing technologies
  • artificial intelligence and use of Neural Network in communication design scenarios.
  • spectrum analyzer to detect the interferance level
  • use of time division technology for defined time slot
  • 3D printed beam steerable surface design
  • complex array configurable antenna sources
  • novel concept for patch design and resonant cavity antenna
  • use of copper painted solution on 3D printed antenna surfaces
  • ralization of 3D printed sources and its effect on sattellite and microwave communication

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Published Papers

XFacebookLinkedIn
Electronics - ISSN 2079-9292