Next Article in Journal
Design and Near-Infrared Actuation of a Gold Nanorod–Polymer Microelectromechanical Device for On-Demand Drug Delivery
Next Article in Special Issue
Fundamental Study for a Graphite-Based Microelectromechanical System
Previous Article in Journal
On-Chip Facile Preparation of Monodisperse Resorcinol Formaldehyde (RF) Resin Microspheres
Previous Article in Special Issue
Controlled Solvent-Free Formation of Embedded PDMS-Derived Carbon Nanodomains with Tunable Fluorescence Using Selective Laser Ablation with A Low-Power CD Laser
Article Menu
Issue 1 (January) cover image

Export Article

Open AccessArticle
Micromachines 2018, 9(1), 26; doi:10.3390/mi9010026

Atomistic and Experimental Investigation of the Effect of Depth of Cut on Diamond Cutting of Cerium

1
Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China
2
Science and Technology on Surface Physics and Chemistry Laboratory, Mianyang 621908, China
*
Authors to whom correspondence should be addressed.
Received: 29 November 2017 / Revised: 3 January 2018 / Accepted: 12 January 2018 / Published: 13 January 2018
(This article belongs to the Special Issue Carbon Based Materials for MEMS/NEMS)
View Full-Text   |   Download PDF [8501 KB, uploaded 13 January 2018]   |  

Abstract

The ultra-precision diamond cutting process exhibits strong size effects due to the ultra-small depth of cut that is comparable with the cutting edge radius. In the present work, we elucidate the underlying machining mechanisms of single crystal cerium under diamond cutting by means of molecular dynamics simulations, with an emphasis on the evaluation of the effect of depth of cut on the cutting process by using different depths of cut. Diamond cutting experiments of cerium with different depths of cut are also conducted. In particular for the smallest depth of cut of 0.2 nm, shallow cutting simulations varying the sharpness of the cutting edge demonstrate that an atomically sharp cutting edge leads to a smaller machining force and better machined surface quality than a blunt one. Simulation results indicate that dislocation slip is the dominant deformation mechanism of cerium under diamond cutting with each depth of cut. Furthermore, the analysis of the defect zone based on atomic radial distribution functions demonstrates that there are trivial phase transformations from γ-Ce to δ-Ce occurred in both the machined surface and the formed chip. It is found that there is a transition of material removal mode from plowing to cutting with the increase of the depth of cut, which is also consistent with the diamond cutting experiments of cerium with different depths of cut. View Full-Text
Keywords: cerium; diamond cutting; depth of cut; phase transformation; molecular dynamics cerium; diamond cutting; depth of cut; phase transformation; molecular dynamics
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Share & Cite This Article

MDPI and ACS Style

Zhang, J.; Shuai, M.; Zheng, H.; Li, Y.; Jin, M.; Sun, T. Atomistic and Experimental Investigation of the Effect of Depth of Cut on Diamond Cutting of Cerium. Micromachines 2018, 9, 26.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top