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Micromachines 2017, 8(9), 284; https://doi.org/10.3390/mi8090284

PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices

1
Department of Engineering Technology, Texas State University, San Marcos, TX 78666, USA
2
School of Mechanical Engineering, Kyungnam University, Changwon 51767, Korea
*
Authors to whom correspondence should be addressed.
Received: 29 August 2017 / Revised: 15 September 2017 / Accepted: 17 September 2017 / Published: 20 September 2017
(This article belongs to the Special Issue Polymer Based MEMS and Microfabrication)
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Abstract

Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers—PMMA to polycarbonate (PC)—to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection. View Full-Text
Keywords: polymethyl methacrylate (PMMA) spin coated polycarbonate (PC); microfluidic; hybrid bonding; thermal bonding; PMMA–PC bonding polymethyl methacrylate (PMMA) spin coated polycarbonate (PC); microfluidic; hybrid bonding; thermal bonding; PMMA–PC bonding
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Song, I.-H.; Park, T. PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices. Micromachines 2017, 8, 284.

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