Interface Tailoring Effect for Heusler Based CPP-GMR with an L12-Type Ag3Mg Spacer
Institute for Materials Research, Tohoku University, Sendai 980-8577, Japan
Center for Spintronics Research Network, Tohoku University, Sendai 980-8577, Japan
Author to whom correspondence should be addressed.
Received: 31 December 2017 / Revised: 19 January 2018 / Accepted: 29 January 2018 / Published: 31 January 2018
Current perpendicular-to-plane (CPP) giant magnetoresistance (GMR) effects are of interest in a possible application of magnetic sensor elements, such as read-head of hard disk drives. To improve the junction performance, the interface tailoring effects were investigated for the Heulser alloy, Co2
Si (CFMS), based CPP-GMR junctions with an
Mg ordered alloy spacer. Ultra-thin Fe or Mg inserts were utilized for the CFMS/Ag3
Mg interfaces, and CPP-GMR at low bias current density, J
and the J
dependence were evaluated for the junctions. Although, at low bias J
, MR ratio decreased with increasing the inserts thickness, the device output at high bias J
exhibited quite weak dependence on the insert thickness. The output voltages of the order of 4 mV were obtained for the junctions regardless of the insert at an optimal bias J
for each. The critical current density
was evaluated by the shape of MR curves depending on J
increased with the insert thicknesses up to 0.45 nm. The enhancement of
suggests that spin-transfer-torque effect may reduce in the junctions with inserts, which enables a reduction of noise and can be an advantage for device applications.
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MDPI and ACS Style
Kubota, T.; Ina, Y.; Wen, Z.; Takanashi, K. Interface Tailoring Effect for Heusler Based CPP-GMR with an L12-Type Ag3Mg Spacer. Materials 2018, 11, 219.
Kubota T, Ina Y, Wen Z, Takanashi K. Interface Tailoring Effect for Heusler Based CPP-GMR with an L12-Type Ag3Mg Spacer. Materials. 2018; 11(2):219.
Kubota, Takahide; Ina, Yusuke; Wen, Zhenchao; Takanashi, Koki. 2018. "Interface Tailoring Effect for Heusler Based CPP-GMR with an L12-Type Ag3Mg Spacer." Materials 11, no. 2: 219.
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