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A Wireless, Passive Sensor for Quantifying Packaged Food Quality
Department of Biomedical Engineering, Michigan Technological University, 1400 Townsend Drive, Houghton, MI 49931, USA
Norinse Technologies LLC, Hancock, MI 49930, USA
* Author to whom correspondence should be addressed.
Received: 23 August 2007; Accepted: 28 August 2007 / Published: 5 September 2007
Abstract: This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printed on a paper substrate. To monitor foodquality, the sensor is embedded inside the food package by adhering it to the package’sinner wall; its response is remotely detected through a coil connected to a sensor reader. Asfood quality degrades due to increasing humidity inside the package, the paper substrateabsorbs water vapor, changing the capacitor’s capacitance and the sensor’s resonantfrequency. Therefore, the taste quality of the packaged food can be indirectly determined bymeasuring the change in the sensor’s resonant frequency. The novelty of this sensortechnology is its wireless and passive nature, which allows in situ determination of foodquality. In addition, the simple fabrication process and inexpensive sensor material ensure alow sensor cost, thus making this technology economically viable.
Keywords: Resonant circuit sensor; food quality monitoring; wireless; passive.
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Cite This Article
MDPI and ACS Style
Tan, E.L.; Ng, W.N.; Shao, R.; Pereles, B.D.; Ong, K.G. A Wireless, Passive Sensor for Quantifying Packaged Food Quality. Sensors 2007, 7, 1747-1756.
Tan EL, Ng WN, Shao R, Pereles BD, Ong KG. A Wireless, Passive Sensor for Quantifying Packaged Food Quality. Sensors. 2007; 7(9):1747-1756.
Tan, Ee L.; Ng, Wen N.; Shao, Ranyuan; Pereles, Brandon D.; Ong, Keat G. 2007. "A Wireless, Passive Sensor for Quantifying Packaged Food Quality." Sensors 7, no. 9: 1747-1756.