Sensors 2007, 7(9), 1747-1756; doi:10.3390/s7091747
Article

A Wireless, Passive Sensor for Quantifying Packaged Food Quality

1 Department of Biomedical Engineering, Michigan Technological University, 1400 Townsend Drive, Houghton, MI 49931, USA 2 Norinse Technologies LLC, Hancock, MI 49930, USA
* Author to whom correspondence should be addressed.
Received: 23 August 2007; Accepted: 28 August 2007 / Published: 5 September 2007
PDF Full-text Download PDF Full-Text [662 KB, uploaded 20 June 2008 16:52 CEST]
Abstract: This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printed on a paper substrate. To monitor foodquality, the sensor is embedded inside the food package by adhering it to the package’sinner wall; its response is remotely detected through a coil connected to a sensor reader. Asfood quality degrades due to increasing humidity inside the package, the paper substrateabsorbs water vapor, changing the capacitor’s capacitance and the sensor’s resonantfrequency. Therefore, the taste quality of the packaged food can be indirectly determined bymeasuring the change in the sensor’s resonant frequency. The novelty of this sensortechnology is its wireless and passive nature, which allows in situ determination of foodquality. In addition, the simple fabrication process and inexpensive sensor material ensure alow sensor cost, thus making this technology economically viable.
Keywords: Resonant circuit sensor; food quality monitoring; wireless; passive.

Article Statistics

Load and display the download statistics.

Citations to this Article

Cite This Article

MDPI and ACS Style

Tan, E.L.; Ng, W.N.; Shao, R.; Pereles, B.D.; Ong, K.G. A Wireless, Passive Sensor for Quantifying Packaged Food Quality. Sensors 2007, 7, 1747-1756.

AMA Style

Tan EL, Ng WN, Shao R, Pereles BD, Ong KG. A Wireless, Passive Sensor for Quantifying Packaged Food Quality. Sensors. 2007; 7(9):1747-1756.

Chicago/Turabian Style

Tan, Ee L.; Ng, Wen N.; Shao, Ranyuan; Pereles, Brandon D.; Ong, Keat G. 2007. "A Wireless, Passive Sensor for Quantifying Packaged Food Quality." Sensors 7, no. 9: 1747-1756.

Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert