Second Generation Small Pixel Technology Using Hybrid Bond Stacking†
AbstractIn this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 µm pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology. View Full-Text
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Venezia, V.C.; Hsiung, A.C.-W.; Yang, W.-Z.; Zhang, Y.; Zhao, C.; Lin, Z.; Grant, L.A. Second Generation Small Pixel Technology Using Hybrid Bond Stacking. Sensors 2018, 18, 667.
Venezia VC, Hsiung AC-W, Yang W-Z, Zhang Y, Zhao C, Lin Z, Grant LA. Second Generation Small Pixel Technology Using Hybrid Bond Stacking. Sensors. 2018; 18(2):667.Chicago/Turabian Style
Venezia, Vincent C.; Hsiung, Alan C.-W.; Yang, Wu-Zang; Zhang, Yuying; Zhao, Cheng; Lin, Zhiqiang; Grant, Lindsay A. 2018. "Second Generation Small Pixel Technology Using Hybrid Bond Stacking." Sensors 18, no. 2: 667.
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