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Sensors 2016, 16(2), 204; doi:10.3390/s16020204

Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures

1
School of Mechanical Engineering, Xi’An Jiaotong University, 28 West Xianning Road, Xi’An 710049, China
2
Birmingham City University, Birmingham B5 5JU, UK
3
Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough LE11 3UZ, UK
4
GE Sensing & Inspection Technologies, Leicestershire LE6 0FH, UK
*
Author to whom correspondence should be addressed.
Academic Editor: Vittorio M.N. Passaro
Received: 14 December 2015 / Revised: 25 January 2016 / Accepted: 2 February 2016 / Published: 5 February 2016
(This article belongs to the Section Physical Sensors)
View Full-Text   |   Download PDF [3240 KB, uploaded 5 February 2016]   |  

Abstract

Single crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and 900 °C, respectively. View Full-Text
Keywords: single crystal silicon; plastic deformation; pressure sensor; microfabrication single crystal silicon; plastic deformation; pressure sensor; microfabrication
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Ren, J.; Ward, M.; Kinnell, P.; Craddock, R.; Wei, X. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures. Sensors 2016, 16, 204.

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