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Sensors 2013, 13(8), 9896-9908; doi:10.3390/s130809896

A Wireless Passive Pressure Microsensor Fabricated in HTCC MEMS Technology for Harsh Environments

1
Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Taiyuan 030051, China
2
Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Taiyuan 030051, China
*
Author to whom correspondence should be addressed.
Received: 9 June 2013 / Revised: 16 July 2013 / Accepted: 30 July 2013 / Published: 2 August 2013
(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
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Abstract

A wireless passive high-temperature pressure sensor without evacuation channel fabricated in high-temperature co-fired ceramics (HTCC) technology is proposed. The properties of the HTCC material ensure the sensor can be applied in harsh environments. The sensor without evacuation channel can be completely gastight. The wireless data is obtained with a reader antenna by mutual inductance coupling. Experimental systems are designed to obtain the frequency-pressure characteristic, frequency-temperature characteristic and coupling distance. Experimental results show that the sensor can be coupled with an antenna at 600 °C and max distance of 2.8 cm at room temperature. The senor sensitivity is about 860 Hz/bar and hysteresis error and repeatability error are quite low.
Keywords: wireless passive; high-temperature co-fired ceramics (HTCC); LC circuit mutual inductance coupling wireless passive; high-temperature co-fired ceramics (HTCC); LC circuit mutual inductance coupling
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MDPI and ACS Style

Tan, Q.; Kang, H.; Xiong, J.; Qin, L.; Zhang, W.; Li, C.; Ding, L.; Zhang, X.; Yang, M. A Wireless Passive Pressure Microsensor Fabricated in HTCC MEMS Technology for Harsh Environments. Sensors 2013, 13, 9896-9908.

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