Special Issue "Sensors for Harsh-Environment Applications"
QuicklinksA special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".
Deadline for manuscript submissions: 31 August 2013
Special Issue Editor
Guest Editor
Dr. Debbie G. Senesky
Stanford University, Durand Building, MC 4035, Stanford, CA 94305-4035, USA
Website: http://xlab.stanford.edu
E-Mail: dsenesky@stanford.edu
Phone: +1 650 7232844
Fax: +1 650 7233018
Interests: harsh environment sensors; wide bandgap semiconductors; compound semiconductors; high-temperature instrumentation; radiation hardened semiconductors; semiconductor sensors; optical sensors; chemical sensors; micromechanical resonators; energy harvesters; piezoelectricity; microfabrication; nanotechnology
Special Issue Information
Dear Colleagues,
The ability to collect data and transduce signals within harsh environments will change the way we engineer automotive engines, industrial gas turbines, aircrafts and well-bore systems (e.g. geothermal and oil and gas exploration). In addition, harsh-environment sensing will allow us to understand environments that are challenging to assess such as the bottom of the ocean, space environments and the human body.
The limitations in silicon-based microelectronics and nanoelectronics has led researchers to identify new material platforms that can operate and survive within high temperature, high radiation, high shock and chemically corrosive environments for extended periods. As a result, new materials science, advanced process technology and compelling demonstrations of transducers that operate well beyond the operation regimes of silicon have been conducted using wide bandgap semiconductor materials such as silicon carbide, aluminum nitride and gallium nitride. This special issue on “Sensors for Harsh-Environment Applications” will provide a critical update on the status of realizing sensors and sensing systems for prohibitive environments. Hence, we solicit review articles and original research papers on materials development, sensor development, electronic devices and energy harvesting for operation within harsh environments environments. Articles that address manufacturing, packaging and system integration methodologies are also considered.
Dr. Debbie G. Senesky
Guest Editor
Submission
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed Open Access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs).
Keywords
- sensors for harsh environments
- high-temperature instrumentation
- ocean sensors
- automotive sensors
- oil and gas sensors
- sensors for space exploration
- wide bandgap NEMS and MEMS technology
- synthesis and analysis of wide bandgap materials
- high-temperature energy harvesting and conversion devices
- interface electronics of harsh environment sensors
- wireless sensor networks for harsh environments
- structural health monitoring for harsh environments
- robust packaging for harsh-environment electronics
Published Papers
Planned Papers
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Authors: Xiaoning Jiang 1, Kyungrim Kim 1, Shujun Zhang 2, Joseph Johnson 1 and Giovanni Salazar 1
Affiliations: 1 North Carolina State University, raleigh, NC 27695, USA; E-Mail: xjiang5@ncsu.edu
2 Pennsylvania State University, University Park, PA 16802, USA
Abstract: Piezoelectric sensing techniques for high temperature applications in aerospace, automotive, and power plants has been intensively explored due to their low cost, compact size, simple signal conditioning, and less temperature dependence as compared with other high temperature sensing techniques. This paper presents an overview of high temperature piezoelectric materials and piezoelectric sensing techniques. Firstly, high temperature sensing techniques including piezoelectric sensing for high temperature applications and their pros and cons will be reviewed. High temperature piezoelectric materials, electrode materials and their challenges for high temperature sensing will next be discussed. Finally, recent work on ultrahigh temperature (>1000 °C) sensing using piezoelectric will be presented, followed by future work discussions.
Last update: 3 May 2013