Special Issue "Sensors for Harsh-Environment Applications"

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A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (15 October 2013)

Special Issue Editor

Guest Editor
Dr. Debbie G. Senesky
Stanford University, Durand Building, MC 4035, Stanford, CA 94305-4035, USA
Website: http://xlab.stanford.edu
E-Mail: dsenesky@stanford.edu
Phone: +1 650 7232844
Fax: +1 650 7233018
Interests: harsh environment sensors; wide bandgap semiconductors; compound semiconductors; high-temperature instrumentation; radiation hardened semiconductors; semiconductor sensors; optical sensors; chemical sensors; micromechanical resonators; energy harvesters; piezoelectricity; microfabrication; nanotechnology

Special Issue Information

Dear Colleagues,

The ability to collect data and transduce signals within harsh environments will change the way we engineer automotive engines, industrial gas turbines, aircrafts and well-bore systems (e.g. geothermal and oil and gas exploration). In addition, harsh-environment sensing will allow us to understand environments that are challenging to assess such as the bottom of the ocean, space environments and the human body.

The limitations in silicon-based microelectronics and nanoelectronics has led researchers to identify new material platforms that can operate and survive within high temperature, high radiation, high shock and chemically corrosive environments for extended periods. As a result, new materials science, advanced process technology and compelling demonstrations of transducers that operate well beyond the operation regimes of silicon have been conducted using wide bandgap semiconductor materials such as silicon carbide, aluminum nitride and gallium nitride. This special issue on “Sensors for Harsh-Environment Applications” will provide a critical update on the status of realizing sensors and sensing systems for prohibitive environments. Hence, we solicit review articles and original research papers on materials development, sensor development, electronic devices and energy harvesting for operation within harsh environments. Articles that address manufacturing, packaging and system integration methodologies are also considered.

Dr. Debbie G. Senesky
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed Open Access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs).


Keywords

  • sensors for harsh environments
  • high-temperature instrumentation
  • ocean sensors
  • automotive sensors
  • oil and gas sensors
  • sensors for space exploration
  • wide bandgap NEMS and MEMS technology
  • synthesis and analysis of wide bandgap materials
  • high-temperature energy harvesting and conversion devices
  • interface electronics of harsh environment sensors
  • wireless sensor networks for harsh environments
  • structural health monitoring for harsh environments
  • robust packaging for harsh-environment electronics

Published Papers (10 papers)

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p. 2280-2304
by , , , ,  and
Sensors 2014, 14(2), 2280-2304; doi:10.3390/s140202280
Received: 5 December 2013; in revised form: 13 January 2014 / Accepted: 17 January 2014 / Published: 29 January 2014
Show/Hide Abstract | Cited by 1 | PDF Full-text (3512 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
p. 144-169
by , , ,  and
Sensors 2014, 14(1), 144-169; doi:10.3390/s140100144
Received: 19 November 2013; in revised form: 10 December 2013 / Accepted: 17 December 2013 / Published: 20 December 2013
Show/Hide Abstract | Cited by 4 | PDF Full-text (2573 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
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p. 17265-17280
by , , , ,  and
Sensors 2013, 13(12), 17265-17280; doi:10.3390/s131217265
Received: 7 November 2013; in revised form: 5 December 2013 / Accepted: 9 December 2013 / Published: 13 December 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
p. 15633-15655
by  and
Sensors 2013, 13(11), 15633-15655; doi:10.3390/s131115633
Received: 10 September 2013; in revised form: 28 October 2013 / Accepted: 11 November 2013 / Published: 15 November 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
p. 15504-15512
by , , , , ,  and
Sensors 2013, 13(11), 15504-15512; doi:10.3390/s131115504
Received: 22 September 2013; in revised form: 23 October 2013 / Accepted: 23 October 2013 / Published: 13 November 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
p. 15324-15347
by ,  and
Sensors 2013, 13(11), 15324-15347; doi:10.3390/s131115324
Received: 30 August 2013; in revised form: 28 October 2013 / Accepted: 30 October 2013 / Published: 8 November 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
p. 15252-15260
by , , , ,  and
Sensors 2013, 13(11), 15252-15260; doi:10.3390/s131115252
Received: 2 September 2013; in revised form: 31 October 2013 / Accepted: 5 November 2013 / Published: 7 November 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
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p. 14175-14188
by , ,  and
Sensors 2013, 13(10), 14175-14188; doi:10.3390/s131014175
Received: 4 September 2013; in revised form: 29 September 2013 / Accepted: 29 September 2013 / Published: 21 October 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
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p. 9896-9908
by , , , , , , ,  and
Sensors 2013, 13(8), 9896-9908; doi:10.3390/s130809896
Received: 9 June 2013; in revised form: 16 July 2013 / Accepted: 30 July 2013 / Published: 2 August 2013
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(This article belongs to the Special Issue Sensors for Harsh-Environment Applications)
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p. 8786-8813
by  and
Sensors 2013, 13(7), 8786-8813; doi:10.3390/s130708786
Received: 2 May 2013; in revised form: 28 June 2013 / Accepted: 3 July 2013 / Published: 10 July 2013
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Last update: 29 November 2013

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