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Sensors 2012, 12(3), 3082-3104; doi:10.3390/s120303082
Review
Measurements of True Leak Rates of MEMS Packages
CALCE Electronic Products and Systems Center, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742, USA
Received: 13 January 2012; in revised form: 24 February 2012 / Accepted: 24 February 2012 / Published: 6 March 2012
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2011)
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Abstract: : Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.
Keywords: MEMS package; hermeticity; helium mass spectrometer; true leak rate; gas conduction; gas diffusion; metallic seals; polymeric seals
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MDPI and ACS Style
Han, B. Measurements of True Leak Rates of MEMS Packages. Sensors 2012, 12, 3082-3104.
AMA StyleHan B. Measurements of True Leak Rates of MEMS Packages. Sensors. 2012; 12(3):3082-3104.
Chicago/Turabian StyleHan, Bongtae. 2012. "Measurements of True Leak Rates of MEMS Packages." Sensors 12, no. 3: 3082-3104.