Sensors 2012, 12(3), 3082-3104; doi:10.3390/s120303082

Measurements of True Leak Rates of MEMS Packages

Received: 13 January 2012; in revised form: 24 February 2012 / Accepted: 24 February 2012 / Published: 6 March 2012
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2011)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: : Gas transport mechanisms that characterize the hermetic behavior of MEMS packages are fundamentally different depending upon which sealing materials are used in the packages. In metallic seals, gas transport occurs through a few nanoscale leak channels (gas conduction) that are produced randomly during the solder reflow process, while gas transport in polymeric seals occurs through the bulk material (gas diffusion). In this review article, the techniques to measure true leak rates of MEMS packages with the two sealing materials are described and discussed: a Helium mass spectrometer based technique for metallic sealing and a gas diffusion based model for polymeric sealing.
Keywords: MEMS package; hermeticity; helium mass spectrometer; true leak rate; gas conduction; gas diffusion; metallic seals; polymeric seals
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MDPI and ACS Style

Han, B. Measurements of True Leak Rates of MEMS Packages. Sensors 2012, 12, 3082-3104.

AMA Style

Han B. Measurements of True Leak Rates of MEMS Packages. Sensors. 2012; 12(3):3082-3104.

Chicago/Turabian Style

Han, Bongtae. 2012. "Measurements of True Leak Rates of MEMS Packages." Sensors 12, no. 3: 3082-3104.

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