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Sensors 2012, 12(4), 4172-4186; doi:10.3390/s120404172

A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

1
Institute of NanoEngineering and MicroSystems, National Tsing Hua University, No. 101, Section 2, Kuang Fu Road, Hsin Chu 30013, Taiwan
2
Department of Power Mechanical Engineering, National Tsing Hua University, No. 101, Section 2, Kuang Fu Road, Hsin Chu 30013, Taiwan
*
Author to whom correspondence should be addressed.
Received: 28 February 2012 / Revised: 16 March 2012 / Accepted: 16 March 2012 / Published: 28 March 2012
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2011)
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Abstract

A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 ´ 10−2 mm−1 and the sensing patch has a thickness of less than 130 μm and 20 ´ 20 mm2 dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors. View Full-Text
Keywords: curvature sensor; flexible electronics; inkjet printing curvature sensor; flexible electronics; inkjet printing
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Huang, Y.-R.; Kuo, S.-A.; Stach, M.; Liu, C.-H.; Liao, K.-H.; Lo, C.-Y. A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing. Sensors 2012, 12, 4172-4186.

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