Next Article in Journal
Reducing False Negative Reads in RFID Data Streams Using an Adaptive Sliding-Window Approach
Next Article in Special Issue
Prediction of Gap Asymmetry in Differential Micro Accelerometers
Previous Article in Journal
Spatial Heterogeneity of Autoinducer Regulation Systems
Previous Article in Special Issue
Measurements of True Leak Rates of MEMS Packages
Sensors 2012, 12(4), 4172-4186; doi:10.3390/s120404172

A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

Received: 28 February 2012 / Revised: 16 March 2012 / Accepted: 16 March 2012 / Published: 28 March 2012
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering 2011)
View Full-Text   |   Download PDF [1425 KB, uploaded 21 June 2014]   |   Browse Figures


A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 ´ 10−2 mm−1 and the sensing patch has a thickness of less than 130 μm and 20 ´ 20 mm2 dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors.
Keywords: curvature sensor; flexible electronics; inkjet printing curvature sensor; flexible electronics; inkjet printing
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Share & Cite This Article

Further Mendeley | CiteULike
Export to BibTeX |
MDPI and ACS Style

Huang, Y.-R.; Kuo, S.-A.; Stach, M.; Liu, C.-H.; Liao, K.-H.; Lo, C.-Y. A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing. Sensors 2012, 12, 4172-4186.

View more citation formats

Related Articles

Article Metrics

For more information on the journal, click here


Cited By

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert