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Journal: Sensors, 2010
Volume: 10
Page(s): 3989-4001
3989-4001
Article: Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
Zaal, J.J.M.; Van Driel, W.D.; Zhang, G.

http://www.mdpi.com/1424-8220/10/4/3989

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