Special Issue "Low k Dielectic Materials"


A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: closed (30 June 2012)

Special Issue Editor

Guest Editor
Dr. Rajendra Singh
The Holcombe Department of Electrical and Computer Engineering, Clemson University, 105 Riggs Hall, Room 206, Clemson, S.C. 29634, USA
Website: http://www.clemson.edu/ces/departments/ece/faculty_staff/faculty/rsingh.html
E-Mail: srajend@clemson.edu
Phone: +1-864-656-0919
Fax: +1-864-656-5910

Special Issue Information

Dear Colleagues,

For Low k dielectric materials, the value of dielectric constant is less than the dielectric constant of silicon dioxide. Such materials are of great importance for multi-level interconnections of nanoelectronics and radio frequency (RF) devices and circuits.  Other applications include optoelectronics, 3-D integrated circuits, microelectromechanical systems (MEMS), nanoelectromechanical (NEMS), sensors and detectors and packaging of various types of devices and circuits. All topics related to synthesis, and properties of low-k dielectrics, various processing techniques, process integration, performance and reliability of low-K based devices, circuits and systems are of interest for this journal issue.

Dr. Rajendra Singh
Guest Editor


  • Low k dielectrics
  • thermal properties
  • structural properties
  • process integration
  • Low k and MEMS
  • Low k and NEMS
  • R-F devices and circuits
  • Low k and 3-D integrated circuits
  • multi-level Interconnections
  • packaging
  • reliability
  • yield

Published Papers (2 papers)

Materials 2012, 5(9), 1602-1625; doi:10.3390/ma5091602
Received: 25 June 2012; in revised form: 30 August 2012 / Accepted: 4 September 2012 / Published: 12 September 2012
Show/Hide Abstract | Cited by 4 | PDF Full-text (301 KB)
abstract graphic

by , , , ,  and
Materials 2012, 5(3), 377-384; doi:10.3390/ma5030377
Received: 19 December 2011; in revised form: 31 January 2012 / Accepted: 15 February 2012 / Published: 2 March 2012
Show/Hide Abstract | Cited by 1 | PDF Full-text (210 KB)

Last update: 27 February 2014

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