Special Issue "Low k Dielectic Materials"

Guest Editor
Dr. Rajendra Singh
The Holcombe Department of Electrical and Computer Engineering, Clemson University, 105 Riggs Hall, Room 206, Clemson, S.C. 29634, USA
Website: http://www.clemson.edu/ces/departments/ece/faculty_staff/faculty/rsingh.html
E-Mail: srajend@clemson.edu
Phone: +1-864-656-0919
Fax: +1-864-656-5910

Dear Colleagues,

For Low k dielectric materials, the value of dielectric constant is less than the dielectric constant of silicon dioxide. Such materials are of great importance for multi-level interconnections of nanoelectronics and radio frequency (RF) devices and circuits.  Other applications include optoelectronics, 3-D integrated circuits, microelectromechanical systems (MEMS), nanoelectromechanical (NEMS), sensors and detectors and packaging of various types of devices and circuits. All topics related to synthesis, and properties of low-k dielectrics, various processing techniques, process integration, performance and reliability of low-K based devices, circuits and systems are of interest for this journal issue.

Dr. Rajendra Singh
Guest Editor

Submission

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• Low k dielectrics
• thermal properties
• structural properties
• process integration
• Low k and MEMS
• Low k and NEMS
• R-F devices and circuits
• Low k and 3-D integrated circuits
• multi-level Interconnections
• packaging
• reliability
• yield

Type of Paper: Article
Title: A Chemical Component Design Method based on Fractal Theory and Its Applications in Low-k and High Thermal Conductivity Ceramics Made of AlN/BN/SiOC
Authors: Xijie Dong and Yifan Hu
Affiliation: School of Physics, Huazhong University of Science and Technology, Wuhan, 430074, China; E-Mail: yifanhu2007@yahoo.com.cn; Tel.: 86-27-87557493; Fax: 86-27-87544525
Abstract: In this work, we develop a new design method based on fractal theory and use it to design low-dielectric constant and high thermal conductivity materials. In particular, we used this method to prepare low-k and high thermal conductivity samples made of AlN/BN/SiOC with different component fractions. Measurements to determine the dielectric and thermal properties have also been performed, and the results show that we successfully synthesized ceramic samples with low dielectric constants (<3.5) and high thermal conductivity (³2 W·m⁻¹·K⁻¹). These results indicate that the proposed material component design method is valid.
Keywords: material design; composite materials; low-dielectric constant; high thermal conductivity