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Thermal Management and Heat Transfer Study in Aero-Devices

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: 10 July 2024 | Viewed by 119

Special Issue Editor


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Guest Editor
Department of Energy and Power Engineering, Tsinghua University, Beijing 100084, China
Interests: mechanism and rules of heat and mass transfer under extreme conditions; thermal protection and heat utilization technology of aerospace high-speed aircraft; design and thermal testing technology of high power density heat transfer device for supercritical pressure fluid; aircraft icing and anti-/de-icing technology

Special Issue Information

Dear Colleagues,

Thermal management and heat transfer play a critical role in ensuring the efficient and reliable operation of aero-devices. With advancements in technology and increasing demands for high-performance aerospace systems, the study of thermal management has become a vital area of research. This field focuses on understanding and optimizing the heat dissipation, thermal insulation, and temperature control mechanisms within aero-devices, such as aircraft engines, gas turbines, and spacecraft components.

Efficient thermal management is crucial for enhancing the overall performance, extending the lifespan, and ensuring the safety of aero-devices. It involves the utilization of advanced materials, innovative cooling techniques, and sophisticated heat transfer analysis. Researchers and engineers strive to develop effective thermal management solutions that can handle the extreme operating conditions experienced by aero-devices, including high temperatures, high pressures, and rapid thermal fluctuations.

Cutting-edge topics in thermal management and heat transfer research include:

Active cooling techniques using microchannels, heat pipes and spray cooling.

Thermoelectric materials for waste heat recovery in aero-devices.

Computational fluid dynamics (CFD) simulations for optimizing heat transfer in aerospace systems.

Additive manufacturing of heat transfer components with complex geometries.

Thermal management of electric propulsion systems in aircraft.

Thermal interface materials for improved heat dissipation in aero-devices.

Thermal analysis and design of hypersonic vehicles.

Thermal management strategies for unmanned aerial vehicles (UAVs) and drones.

These topics represent the forefront of research in thermal management and heat transfer in aero-devices, addressing the challenges posed by evolving aerospace technologies.

Dr. Chao Wang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
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