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Journal: Proceedings, 2017
Volume: 1
Number: 337
Article:
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process
Authors:
by
S. H. Tseng, C. Y. Yeh, A. Y. Chang, Y. J. Wang, P. C. Chen, H. H. Tsai and Y. Z. Juang
Link:
https://www.mdpi.com/2504-3900/1/4/337
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