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Nanomaterials 2012, 2(4), 445-475; doi:10.3390/nano2040445
Review

Polyhedral Oligomeric Silsesquioxane (POSS)-Containing Polymer Nanocomposites

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Received: 19 September 2012; in revised form: 20 November 2012 / Accepted: 26 November 2012 / Published: 6 December 2012
(This article belongs to the Special Issue Composite Nanomaterials)
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Abstract: Hybrid materials with superior structural and functional properties can be obtained by incorporating nanofillers into polymer matrices. Polyhedral oligomeric silsesquioxane (POSS) nanoparticles have attracted much attention recently due to their nanometer size, the ease of which these particles can be incorporated into polymeric materials and the unique capability to reinforce polymers. We review here the state of POSS-containing polymer nanocomposites. We discuss the influence of the incorporation of POSS into polymer matrices via chemical cross-linking or physical blending on the structure of nanocomposites, as affected by surface functional groups, and the POSS concentration.
Keywords: inorganic-organic nanocomposites; polyhedral oligomeric silsesquioxane (POSS); hybrid polymer; mechanical properties; thermal stability inorganic-organic nanocomposites; polyhedral oligomeric silsesquioxane (POSS); hybrid polymer; mechanical properties; thermal stability
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Ayandele, E.; Sarkar, B.; Alexandridis, P. Polyhedral Oligomeric Silsesquioxane (POSS)-Containing Polymer Nanocomposites. Nanomaterials 2012, 2, 445-475.

AMA Style

Ayandele E, Sarkar B, Alexandridis P. Polyhedral Oligomeric Silsesquioxane (POSS)-Containing Polymer Nanocomposites. Nanomaterials. 2012; 2(4):445-475.

Chicago/Turabian Style

Ayandele, Ebunoluwa; Sarkar, Biswajit; Alexandridis, Paschalis. 2012. "Polyhedral Oligomeric Silsesquioxane (POSS)-Containing Polymer Nanocomposites." Nanomaterials 2, no. 4: 445-475.


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