3D Printing Solutions for Microfluidic Chip-To-World Connections
AbstractThe connection of microfluidic devices to the outer world by tubes and wires is an underestimated issue. We present methods based on 3D printing to realize microfluidic chip holders with reliable fluidic and electric connections. The chip holders are constructed by microstereolithography, an additive manufacturing technique with sub-millimeter resolution. The fluidic sealing between the chip and holder is achieved by placing O-rings, partly integrated into the 3D-printed structure. The electric connection of bonding pads located on microfluidic chips is realized by spring-probes fitted within the printed holder. Because there is no gluing or wire bonding necessary, it is easy to change the chip in the measurement setup. The spring probes and O-rings are aligned automatically because of their fixed position within the holder. In the case of bioanalysis applications such as cells, a limitation of 3D-printed objects is the leakage of cytotoxic residues from the printing material, cured resin. This was solved by coating the 3D-printed structures with parylene-C. The combination of silicon/glass microfluidic chips fabricated with highly-reliable clean-room technology and 3D-printed chip holders for the chip-to-world connection is a promising solution for applications where biocompatibility, optical transparency and accurate sample handling must be assured. 3D printing technology for such applications will eventually arise, enabling the fabrication of complete microfluidic devices. View Full-Text
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van den Driesche, S.; Lucklum, F.; Bunge, F.; Vellekoop, M.J. 3D Printing Solutions for Microfluidic Chip-To-World Connections. Micromachines 2018, 9, 71.
van den Driesche S, Lucklum F, Bunge F, Vellekoop MJ. 3D Printing Solutions for Microfluidic Chip-To-World Connections. Micromachines. 2018; 9(2):71.Chicago/Turabian Style
van den Driesche, Sander; Lucklum, Frieder; Bunge, Frank; Vellekoop, Michael J. 2018. "3D Printing Solutions for Microfluidic Chip-To-World Connections." Micromachines 9, no. 2: 71.
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