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Micromachines 2017, 8(8), 243; doi:10.3390/mi8080243

High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis

1
College of Internet of Things Engineering, Hohai University, Changzhou 213022, China
2
Jiangsu Key Laboratory of Power Transmission and Distribution Equipment Technology, 200 JinLing Road North, Changzhou 213022, China
*
Author to whom correspondence should be addressed.
Received: 8 July 2017 / Revised: 28 July 2017 / Accepted: 4 August 2017 / Published: 6 August 2017
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Abstract

High aspect ratio three-dimensional micro- and nanopatterns have important applications in diverse fields. However, fabricating these structures by a nanoimprinting method invites problems like collapse, dislocation, and defects. Finite-element analysis (FEA) is a good approach to help understand the filling process and stress distribution. The FEA method was employed to simulate the nanoimprinting process using positive and negative molds with aspect ratios of 1:1, 3:1, 5:1, and 7:1. During the filling process, the resist adjacent to boundaries has the maximum displacement. The corners of contact areas between the protruding part of the mold and the resist has the maximum Von Mises stress. For both positive and negative molds, the maximum stress in the mold increases with aspect ratio. However, filling up negative molds is more difficult than positive ones. With the same aspect ratio, the maximum stress in a negative mold is approximately twice as large as that in a positive one. View Full-Text
Keywords: nanoimprint lithography; high aspect ratio; mold; cavity filling; stress; finite-element analysis nanoimprint lithography; high aspect ratio; mold; cavity filling; stress; finite-element analysis
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Sun, H.; Yin, M.; Wang, H. High Aspect Ratio Nanoimprint Mold-Cavity Filling and Stress Simulation Based on Finite-Element Analysis. Micromachines 2017, 8, 243.

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