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Micromachines 2016, 7(6), 95; doi:10.3390/mi7060095

Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process

Korea Institute of Industrial Technology, 143 Hanggaulro, Sangnok-gu, Ansan-si, Gyeonggi-do 15588, Korea
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Academic Editors: Frank Niklaus and Roy Knechtel
Received: 29 March 2016 / Revised: 12 May 2016 / Accepted: 18 May 2016 / Published: 24 May 2016
(This article belongs to the Special Issue 3D Integration Technologies for MEMS)
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Abstract

Wafer-level packaging (WLP) is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predictability. Among the various defect factors, the die shift primarily determines the quality of the final product; therefore, predicting the die shift is necessary to achieve high-yield production in WLP. In this study, the die shift caused by the flow drag force of the epoxy molding compound (EMC) is evaluated from the die shift of a debonded molding wafer. Experimental and analytical methods were employed to evaluate the die shift occurring during each stage of the molding process and that resulting from the geometrical changes after the debonding process. The die shift caused by the EMC flow drag force is evaluated from the data on die movements due to thermal contraction/expansion and warpage. The relationship between the die shift and variation in the die gap is determined through regression analysis in order to predict the die shift due to the flow drag force. The results can be used for die realignment by predicting and compensating for the die shift. View Full-Text
Keywords: wafer-level molding; compression molding; die shift; flow drag force; compensation method wafer-level molding; compression molding; die shift; flow drag force; compensation method
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Yeon, S.; Park, J.; Lee, H.-J. Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process. Micromachines 2016, 7, 95.

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