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Micromachines 2016, 7(3), 51; doi:10.3390/mi7030051

An Investigation of Processes for Glass Micromachining

1
Microsystem Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan
2
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Rolf Wuthrich
Received: 15 February 2016 / Revised: 11 March 2016 / Accepted: 14 March 2016 / Published: 22 March 2016
(This article belongs to the Special Issue Glass Micromachining)
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Abstract

This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2 cm × 2 cm Tempax glass wafer with an etching depth of approximately 150 µm is demonstrated. The Tempax glass structure with an etching depth and sides of approximately 20 μm was observed via the wet etching process. The most important aspect of this work was to develop RIE and glass reflow techniques. The current challenges of these methods are addressed here. Deep Tempax glass pillars having a smooth surface, vertical shapes, and a high aspect ratio of 10 with 1-μm-diameter glass pillars, a 2-μm pitch, and a 10-μm etched depth were achieved via the RIE technique. Through-silicon wafer interconnects, embedded inside the Tempax glass, are successfully demonstrated via the glass reflow technique. Glass reflow into large cavities (larger than 100 μm), a micro-trench (0.8-μm wide trench), and a micro-capillary (1-μm diameter) are investigated. An additional optimization of process flow was performed for glass penetration into micro-scale patterns. View Full-Text
Keywords: glass micromachining; wet etching; sandblast; reactive ion etching; glass reflow process glass micromachining; wet etching; sandblast; reactive ion etching; glass reflow process
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Van Toan, N.; Toda, M.; Ono, T. An Investigation of Processes for Glass Micromachining. Micromachines 2016, 7, 51.

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