A Versatile Bonding Method for PDMS and SU-8 and Its Application towards a Multifunctional Microfluidic Device
AbstractThis paper reports a versatile and irreversible bonding method for poly(dimethylsiloxane) (PDMS) and SU-8. The method is based on epoxide opening and dehydration reactions between surface-modified PDMS and SU-8. A PDMS replica is first activated via the low-cost lab equipment, i.e., the oxygen plasma cleaner or the corona treater. Then both SU-8 and plasma-treated PDMS samples are functionalized using hydrolyzed (3-aminopropyl)triethoxysilane (APTES). Ultimately, the samples are simply brought into contact and heated to enable covalent bonding. The molecular coupling and chemical reactions behind the bonding occurring at the surfaces were characterized by water contact angle measurement and X-ray photoelectron spectroscopy (XPS) analysis. The reliability of bonded PDMS-SU-8 samples was examined by using tensile strength and leakage tests, which revealed a bonding strength of over 1.4 MPa. The presented bonding method was also applied to create a metal-SU-8-PDMS hybrid device, which integrated SU-8 microfluidic structures and microelectrodes. This hybrid system was used for the effective trapping of microparticles on-chip, and the selective releasing and identification of predefined trapped microparticles. The hybrid fabrication approach presented here, based on the PDMS-SU-8 bonding, enables multifunctional integration in complex microfluidic devices. View Full-Text
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Zhu, Z.; Chen, P.; Liu, K.; Escobedo, C. A Versatile Bonding Method for PDMS and SU-8 and Its Application towards a Multifunctional Microfluidic Device. Micromachines 2016, 7, 230.
Zhu Z, Chen P, Liu K, Escobedo C. A Versatile Bonding Method for PDMS and SU-8 and Its Application towards a Multifunctional Microfluidic Device. Micromachines. 2016; 7(12):230.Chicago/Turabian Style
Zhu, Zhen; Chen, Pan; Liu, Kegang; Escobedo, Carlos. 2016. "A Versatile Bonding Method for PDMS and SU-8 and Its Application towards a Multifunctional Microfluidic Device." Micromachines 7, no. 12: 230.
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