Wafer-Level Hybrid Integration of Complex Micro-Optical Modules
AbstractA series of technological steps concentrating around photolithography and UV polymer on glass replication in a mask-aligner that allow for the cost-effective generation of rather complex micro-optical systems on the wafer level are discussed. In this approach, optical functional surfaces are aligned to each other and stacked on top of each other at a desired axial distance. They can consist of lenses, achromatic doublets, regular or chirped lens arrays, diffractive elements, apertures, filter structures, reflecting layers, polarizers, etc. The suitability of the separated modules in certain imaging and non-imaging applications will be shown. View Full-Text
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Dannberg, P.; Wippermann, F.; Brückner, A.; Matthes, A.; Schreiber, P.; Bräuer, A. Wafer-Level Hybrid Integration of Complex Micro-Optical Modules. Micromachines 2014, 5, 325-340.
Dannberg P, Wippermann F, Brückner A, Matthes A, Schreiber P, Bräuer A. Wafer-Level Hybrid Integration of Complex Micro-Optical Modules. Micromachines. 2014; 5(2):325-340.Chicago/Turabian Style
Dannberg, Peter; Wippermann, Frank; Brückner, Andreas; Matthes, Andre; Schreiber, Peter; Bräuer, Andreas. 2014. "Wafer-Level Hybrid Integration of Complex Micro-Optical Modules." Micromachines 5, no. 2: 325-340.