Micromachines 2014, 5(2), 325-340; doi:10.3390/mi5020325

Wafer-Level Hybrid Integration of Complex Micro-Optical Modules

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Received: 31 March 2014; in revised form: 21 May 2014 / Accepted: 27 May 2014 / Published: 5 June 2014
(This article belongs to the Special Issue Microlenses)
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Abstract: A series of technological steps concentrating around photolithography and UV polymer on glass replication in a mask-aligner that allow for the cost-effective generation of rather complex micro-optical systems on the wafer level are discussed. In this approach, optical functional surfaces are aligned to each other and stacked on top of each other at a desired axial distance. They can consist of lenses, achromatic doublets, regular or chirped lens arrays, diffractive elements, apertures, filter structures, reflecting layers, polarizers, etc. The suitability of the separated modules in certain imaging and non-imaging applications will be shown.
Keywords: fabrication techniques; lithography; microlens; polymer; UV curing; hybrid integration
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MDPI and ACS Style

Dannberg, P.; Wippermann, F.; Brückner, A.; Matthes, A.; Schreiber, P.; Bräuer, A. Wafer-Level Hybrid Integration of Complex Micro-Optical Modules. Micromachines 2014, 5, 325-340.

AMA Style

Dannberg P, Wippermann F, Brückner A, Matthes A, Schreiber P, Bräuer A. Wafer-Level Hybrid Integration of Complex Micro-Optical Modules. Micromachines. 2014; 5(2):325-340.

Chicago/Turabian Style

Dannberg, Peter; Wippermann, Frank; Brückner, Andreas; Matthes, Andre; Schreiber, Peter; Bräuer, Andreas. 2014. "Wafer-Level Hybrid Integration of Complex Micro-Optical Modules." Micromachines 5, no. 2: 325-340.

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