Next Article in Journal / Special Issue
Modeling Self-Assembly Across Scales: The Unifying Perspective of Smart Minimal Particles
Previous Article in Journal / Special Issue
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Micromachines 2011, 2(1), 69-81; doi:10.3390/mi2010069

Notes on Article Versions

NoteDate
article html file updated22 January 2013 11:39 CET
article html file updated26 January 2013 01:22 CET
article html file updated28 January 2013 21:28 CET
article html file updated5 February 2013 23:59 CET
article html file updated6 February 2013 20:06 CET
Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert