Next Article in Journal / Special Issue
Modeling Self-Assembly Across Scales: The Unifying Perspective of Smart Minimal Particles
Previous Article in Journal / Special Issue
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Micromachines 2011, 2(1), 69-81; doi:10.3390/mi2010069
Article

Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

1,* , 1, 1,2
 and
1
1 Sensors & Electron Devices Directorate, US Army Research Laboratory, 2800 Powder Mill Rd, Adelphi, MD 20783, USA 2 Materials Science and Engineering, Johns Hopkins University, 3400 North Charles St., Baltimore, MD 21218, USA
* Author to whom correspondence should be addressed.
Received: 1 January 2011 / Revised: 20 February 2011 / Accepted: 23 February 2011 / Published: 1 March 2011
(This article belongs to the Special Issue Self-Assembly)
View Full-Text   |   Download PDF [964 KB, 3 March 2011; original version 1 March 2011]   |  

Abstract

Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the use of magnetic and capillary forces to self-assemble 280 µm sized silicon building blocks into interconnected structures which approach a three-dimensional crystalline configuration. Integrated permanent magnet microstructures provided magnetic forces, while a low-melting-point solder alloy provided capillary forces. A finite element model of forces between the magnetic features demonstrated the utility of magnetic forces at this size scale. Despite a slight departure from designed dimensions in the actual fabricated parts, the combination of magnetic and capillary forces improved the assembly yield to 8%, over approximately 0.1% achieved previously with capillary forces alone.
Keywords: self-assembly; solder; magnetic forces self-assembly; solder; magnetic forces
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).
SciFeed

Share & Cite This Article

Further Mendeley | CiteULike
Export to BibTeX |
EndNote |
RIS
MDPI and ACS Style

Morris, C.J.; Isaacson, B.; Grapes, M.D.; Dubey, M. Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions. Micromachines 2011, 2, 69-81.

View more citation formats

Related Articles

Article Metrics

For more information on the journal, click here

Comments

[Return to top]
Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert