Micromachines 2011, 2(1), 69-81; doi:10.3390/mi2010069
Article

Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

1,* email, 1, 1,2email and 1email
Received: 1 January 2011; in revised form: 20 February 2011 / Accepted: 23 February 2011 / Published: 1 March 2011
(This article belongs to the Special Issue Self-Assembly)
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: Self-assembly is a promising technique to overcome fundamental limitations with integrating, packaging, and general handling of individual electronic-related components with characteristic lengths significantly smaller than 1 mm. Here we describe the use of magnetic and capillary forces to self-assemble 280 µm sized silicon building blocks into interconnected structures which approach a three-dimensional crystalline configuration. Integrated permanent magnet microstructures provided magnetic forces, while a low-melting-point solder alloy provided capillary forces. A finite element model of forces between the magnetic features demonstrated the utility of magnetic forces at this size scale. Despite a slight departure from designed dimensions in the actual fabricated parts, the combination of magnetic and capillary forces improved the assembly yield to 8%, over approximately 0.1% achieved previously with capillary forces alone.
Keywords: self-assembly; solder; magnetic forces
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MDPI and ACS Style

Morris, C.J.; Isaacson, B.; Grapes, M.D.; Dubey, M. Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions. Micromachines 2011, 2, 69-81.

AMA Style

Morris CJ, Isaacson B, Grapes MD, Dubey M. Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions. Micromachines. 2011; 2(1):69-81.

Chicago/Turabian Style

Morris, Christopher J.; Isaacson, Brian; Grapes, Michael D.; Dubey, Madan. 2011. "Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions." Micromachines 2, no. 1: 69-81.

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