Hybrid Integrated Platforms for Silicon Photonics
AbstractA review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics. View Full-Text
Scifeed alert for new publicationsNever miss any articles matching your research from any publisher
- Get alerts for new papers matching your research
- Find out the new papers from selected authors
- Updated daily for 49'000+ journals and 6000+ publishers
- Define your Scifeed now
Liang, D.; Roelkens, G.; Baets, R.; Bowers, J.E. Hybrid Integrated Platforms for Silicon Photonics. Materials 2010, 3, 1782-1802.
Liang D, Roelkens G, Baets R, Bowers JE. Hybrid Integrated Platforms for Silicon Photonics. Materials. 2010; 3(3):1782-1802.Chicago/Turabian Style
Liang, Di; Roelkens, Gunther; Baets, Roel; Bowers, John E. 2010. "Hybrid Integrated Platforms for Silicon Photonics." Materials 3, no. 3: 1782-1802.