Next Article in Journal
Previous Article in Journal
Sensors 2009, 9(6), 4986-5000; doi:10.3390/s90604986
Article

Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications

1
, 1
, 2
, 1,*  and 1
Received: 10 May 2009; in revised form: 9 June 2009 / Accepted: 10 June 2009 / Published: 24 June 2009
(This article belongs to the Section Physical Sensors)
View Full-Text   |   Download PDF [377 KB, uploaded 21 June 2014]   |   Browse Figures
Abstract: A high-frequency ultrasonic transducer for copper or gold wire bonding has been designed, analyzed, prototyped and tested. Modeling techniques were used in the design phase and a practical design procedure was established and used. The transducer was decomposed into its elementary components. For each component, an initial design was obtained with simulations using a finite elements model (FEM). Simulated ultrasonic modules were built and characterized experimentally through the Laser Doppler Vibrometer (LDV) and electrical resonance spectra. Compared with experimental data, the FEM could be iteratively adjusted and updated. Having achieved a remarkably highly-predictive FEM of the whole transducer, the design parameters could be tuned for the desired applications, then the transducer is fixed on the wire bonder with a complete holder clamping was calculated by the FEM. The approach to mount ultrasonic transducers on wire bonding machines also is of major importance for wire bonding in modern electronic packaging. The presented method can lead to obtaining a nearly complete decoupling clamper design of the transducer to the wire bonder.
Keywords: ultrasonic transducer; wire bonding; axial / longitudinal vibration mode ultrasonic transducer; wire bonding; axial / longitudinal vibration mode
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Export to BibTeX |
EndNote


MDPI and ACS Style

Yan, T.-H.; Wang, W.; Chen, X.-D.; Li, Q.; Xu, C. Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications. Sensors 2009, 9, 4986-5000.

AMA Style

Yan T-H, Wang W, Chen X-D, Li Q, Xu C. Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications. Sensors. 2009; 9(6):4986-5000.

Chicago/Turabian Style

Yan, Tian-Hong; Wang, Wei; Chen, Xue-Dong; Li, Qing; Xu, Chang. 2009. "Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications." Sensors 9, no. 6: 4986-5000.



Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert