Next Article in Journal
Tightly-Coupled GNSS/Vision Using a Sky-Pointing Camera for Vehicle Navigation in Urban Areas
Next Article in Special Issue
Vibration of a Rotating Micro-Ring under Electrical Field Based on Inextensible Approximation
Previous Article in Journal
Evaluation of Over-The-Row Harvester Damage in a Super-High-Density Olive Orchard Using On-Board Sensing Techniques
Previous Article in Special Issue
Key Processes of Silicon-On-Glass MEMS Fabrication Technology for Gyroscope Application
Article Menu
Issue 4 (April) cover image

Export Article

Open AccessArticle
Sensors 2018, 18(4), 1243; https://doi.org/10.3390/s18041243

Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach

1
Department of Civil and Environmental Engineering, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
2
Department of Civil Engineering, University of Nebraska-Lincoln, 2200 Vine St, Lincoln, NE 68503, USA
*
Author to whom correspondence should be addressed.
Received: 2 March 2018 / Revised: 13 April 2018 / Accepted: 14 April 2018 / Published: 17 April 2018
(This article belongs to the Collection Modeling, Testing and Reliability Issues in MEMS Engineering)
View Full-Text   |   Download PDF [7137 KB, uploaded 3 May 2018]   |  

Abstract

Microscale uncertainties related to the geometry and morphology of polycrystalline silicon films, constituting the movable structures of micro electro-mechanical systems (MEMS), were investigated through a joint numerical/experimental approach. An on-chip testing device was designed and fabricated to deform a compliant polysilicon beam. In previous studies, we showed that the scattering in the input–output characteristics of the device can be properly described only if statistical features related to the morphology of the columnar polysilicon film and to the etching process adopted to release the movable structure are taken into account. In this work, a high fidelity finite element model of the device was used to feed a transitional Markov chain Monte Carlo (TMCMC) algorithm for the estimation of the unknown parameters governing the aforementioned statistical features. To reduce the computational cost of the stochastic analysis, a synergy of proper orthogonal decomposition (POD) and kriging interpolation was adopted. Results are reported for a batch of nominally identical tested devices, in terms of measurement error-affected probability distributions of the overall Young’s modulus of the polysilicon film and of the overetch depth. View Full-Text
Keywords: micro electro-mechanical systems (MEMS); uncertainty quantification; transitional Markov chain Monte Carlo (TMCMC) analysis; reduced-order modeling; polysilicon morphology; overetch micro electro-mechanical systems (MEMS); uncertainty quantification; transitional Markov chain Monte Carlo (TMCMC) analysis; reduced-order modeling; polysilicon morphology; overetch
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Mirzazadeh, R.; Eftekhar Azam, S.; Mariani, S. Mechanical Characterization of Polysilicon MEMS: A Hybrid TMCMC/POD-Kriging Approach. Sensors 2018, 18, 1243.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Sensors EISSN 1424-8220 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top