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Journal: Sensors, 2017
Volume: 17
Number: 599
Article:
High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor
Authors:
by
Liying Wang, Xiaohui Du, Lingyun Wang, Zhanhao Xu, Chenying Zhang and Dandan Gu
Link:
https://www.mdpi.com/1424-8220/17/3/599
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