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Sensors 2017, 17(4), 857; doi:10.3390/s17040857

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

State Key Laboratory for Mechanical Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China
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Academic Editor: Mustafa Yavuz
Received: 20 February 2017 / Revised: 5 April 2017 / Accepted: 10 April 2017 / Published: 14 April 2017
(This article belongs to the Special Issue MEMS and Nano-Sensors)
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Abstract

A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch. View Full-Text
Keywords: TFTCs; range analysis; optimal design TFTCs; range analysis; optimal design
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Zhang, Z.; Tian, B.; Yu, Q.; Shi, P.; Lin, Q.; Zhao, N.; Jing, W.; Jiang, Z. Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates. Sensors 2017, 17, 857.

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