Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications
AbstractThis paper presents a thin film structure suitable for low-level radiation measurements in lab-on-chip systems that are subject to thermal treatments of the analyte and/or to large temperature variations. The device is the series connection of two amorphous silicon/amorphous silicon carbide heterojunctions designed to perform differential current measurements. The two diodes experience the same temperature, while only one is exposed to the incident radiation. Under these conditions, temperature and light are the common and differential mode signals, respectively. A proper electrical connection reads the differential current of the two diodes (ideally the photocurrent) as the output signal. The experimental characterization shows the benefits of the differential structure in minimizing the temperature effects with respect to a single diode operation. In particular, when the temperature varies from 23 to 50 °C, the proposed device shows a common mode rejection ratio up to 24 dB and reduces of a factor of three the error in detecting very low-intensity light signals. View Full-Text
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de Cesare, G.; Carpentiero, M.; Nascetti, A.; Caputo, D. Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications. Sensors 2016, 16, 267.
de Cesare G, Carpentiero M, Nascetti A, Caputo D. Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications. Sensors. 2016; 16(2):267.Chicago/Turabian Style
de Cesare, Giampiero; Carpentiero, Matteo; Nascetti, Augusto; Caputo, Domenico. 2016. "Thin Film Differential Photosensor for Reduction of Temperature Effects in Lab-on-Chip Applications." Sensors 16, no. 2: 267.
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