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Sensors 2014, 14(3), 4290-4311; doi:10.3390/s140304290

An Integrated Thermal Compensation System for MEMS Inertial Sensors

Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan
Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan
Department of Electronic Engineering, Kun-Shan University, Tainan 710, Taiwan
Author to whom correspondence should be addressed.
Received: 9 January 2014 / Revised: 24 February 2014 / Accepted: 27 February 2014 / Published: 4 March 2014
(This article belongs to the Section Physical Sensors)


An active thermal compensation system for a low temperature-bias-drift (TBD) MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Moreover, a drive/readout ASIC, implemented by the 0.25 µm 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the readout ASIC. Finally, some experimental results demonstrate that the TBD of the micro-gyroscope can be compensated effectively by the proposed compensation system. View Full-Text
Keywords: MEMS; gyroscope; silicon-on-glass; temperature bias drift; delta-sigma modulation; thermal compensation MEMS; gyroscope; silicon-on-glass; temperature bias drift; delta-sigma modulation; thermal compensation

This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Chiu, S.-R.; Teng, L.-T.; Chao, J.-W.; Sue, C.-Y.; Lin, C.-H.; Chen, H.-R.; Su, Y.-K. An Integrated Thermal Compensation System for MEMS Inertial Sensors. Sensors 2014, 14, 4290-4311.

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