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Thermal Strain Analysis of Optic Fiber Sensors
Department of Mechanical Engineering, Yuan Ze University, Chung-Li 320, Taiwan
* Author to whom correspondence should be addressed.
Received: 16 January 2013; in revised form: 24 January 2013 / Accepted: 28 January 2013 / Published: 31 January 2013
Abstract: An optical fiber sensor surface bonded onto a host structure and subjected to a temperature change is analytically studied in this work. The analysis is developed in order to assess the thermal behavior of an optical fiber sensor designed for measuring the strain in the host structure. For a surface bonded optical fiber sensor, the measuring sensitivity is strongly dependent on the bonding characteristics which include the protective coating, adhesive layer and the bonding length. Thermal stresses can be generated due to a mismatch of thermal expansion coefficients between the optical fiber and host structure. The optical fiber thermal strain induced by the host structure is transferred via the adhesive layer and protective coating. In this investigation, an analytical expression of the thermal strain and stress in the optical fiber is presented. The theoretical predictions are validated using the finite element method. Numerical results show that the thermal strain and stress are linearly dependent on the difference in thermal expansion coefficients between the optical fiber and host structure and independent of the thermal expansion coefficients of the adhesive and coating.
Keywords: optic fiber sensor; thermal strain; thermal expansion coefficient
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MDPI and ACS Style
Her, S.-C.; Huang, C.-Y. Thermal Strain Analysis of Optic Fiber Sensors. Sensors 2013, 13, 1846-1855.
Her S-C, Huang C-Y. Thermal Strain Analysis of Optic Fiber Sensors. Sensors. 2013; 13(2):1846-1855.
Her, Shiuh-Chuan; Huang, Chih-Ying. 2013. "Thermal Strain Analysis of Optic Fiber Sensors." Sensors 13, no. 2: 1846-1855.