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Journal: Sensors, 2011
Volume: 11
Page(s): 6257-6269

Article: Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate
Huang, C.-H.; Lee, C.-H.; Hsieh, T.-M.; Tsao, L.-C.; Wu, S.; Liou, J.-C.; Wang, M.-Y.; Chen, L.-C.; Yip, M.-C.; Fang, W.

http://www.mdpi.com/1424-8220/11/6/6257

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