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Sensors 2010, 10(6), 5888-5898; doi:10.3390/s100605888

Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors

*, , , , ,  and
The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo, Japan
* Author to whom correspondence should be addressed.
Received: 20 April 2010 / Revised: 15 May 2010 / Accepted: 30 May 2010 / Published: 9 June 2010
(This article belongs to the Special Issue Glucose Sensors)
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We have developed a package for disposable glucose sensor chips using Parylene encapsulation of a glucose oxidase solution in the liquid phase and a cover structure made of an ultraviolet (UV) curable adhesive. Parylene was directly deposited onto a small volume (1 μL) of glucose oxidase solution through chemical vapor deposition. The cover and reaction chamber were constructed on Parylene film using a UV-curable adhesive and photolithography. The package was processed at room temperature to avoid denaturation of the glucose oxidase. The glucose oxidase solution was encapsulated and unsealed. Glucose sensing was demonstrated using standard amperometric detection at glucose concentrations between 0.1 and 100 mM, which covers the glucose concentration range of diabetic patients. Our proposed Parylene encapsulation and UV-adhesive cover form a liquid phase glucose-oxidase package that has the advantages of room temperature processing and direct liquid encapsulation of a small volume solution without use of conventional solidifying chemicals.
Keywords: glucose sensor; glucose oxidase; Parylene; packaging glucose sensor; glucose oxidase; Parylene; packaging
This is an open access article distributed under the Creative Commons Attribution License (CC BY) which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Takamatsu, S.; Takano, H.; Binh-Khiem, N.; Takahata, T.; Iwase, E.; Matsumoto, K.; Shimoyama, I. Liquid-Phase Packaging of a Glucose Oxidase Solution with Parylene Direct Encapsulation and an Ultraviolet Curing Adhesive Cover for Glucose Sensors. Sensors 2010, 10, 5888-5898.

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