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Molecules 2012, 17(7), 8587-8594; doi:10.3390/molecules17078587
Article

Effect of Curing Agent and Temperature on the Rheological Behavior of Epoxy Resin Systems

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Received: 15 May 2012; in revised form: 7 July 2012 / Accepted: 10 July 2012 / Published: 17 July 2012
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Abstract: The effect of curing agent (6610) content and temperature on the rheological behavior of the epoxy resin CYD-128 was studied by DSC analysis and viscosity experiments. The results show that the resin system meets the requirements of processing technology. A complete reaction occurs when the curing agent content (40 parts per hundred resin, phr) is a little higher than the theoretical value (33.33 phr), while the degree of reaction of the resin system is reduced when the curing agent content is lower (25.00 phr) than theoretical value. However, excessive curing agent (50.00 phr) results in a lower reaction rate. Curing agent content has little influence on gel time when curing agent content exceeded 33.33 phr and the temperature was less than 70 °C. The isothermal viscosity-time curves shift towards the –x axis when the temperature rises from 50 °C to 80 °C. Meanwhile, higher temperature results in higher reaction rates.
Keywords: epoxy resins; cure kinetics; curing agent; rheological behavior epoxy resins; cure kinetics; curing agent; rheological behavior
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Zhao, C.; Zhang, G.; Zhao, L. Effect of Curing Agent and Temperature on the Rheological Behavior of Epoxy Resin Systems. Molecules 2012, 17, 8587-8594.

AMA Style

Zhao C, Zhang G, Zhao L. Effect of Curing Agent and Temperature on the Rheological Behavior of Epoxy Resin Systems. Molecules. 2012; 17(7):8587-8594.

Chicago/Turabian Style

Zhao, Chenhui; Zhang, Guangcheng; Zhao, Lei. 2012. "Effect of Curing Agent and Temperature on the Rheological Behavior of Epoxy Resin Systems." Molecules 17, no. 7: 8587-8594.



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