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Keywordssevere-plastic-deformation (SPD); contact wire; Cu-Mg alloy; ultrafine grained (UFG); conductivity; strength; AlMgSi0.5 alloy; ECAP; pitting corrosion; micro-capillary cell; deformation localization; Ti; cryomilling; high pressure torsion; nanostructure; strengthening; SPD; ECFE; mechanical properties; impact behavior; grain size; Al alloy; severe plastic deformation; high pressure torsion; ultrafine-grained microstructure; mechanical strength; fatigue properties; austenitic stainless steel; severe plastic deformation; deformation twinning; strain-induced martensite; grain refinement; nanocrystalline structure; strengthening; severe plastic deformation; bulk metallic glass; Zr; accumulative roll bonding (ARB); austenitic steel; ultrafine-grained microstructure; strength; nano-twinning; strain rate sensitivity; Cu-Ni-Si alloys; swaging; accumulative roll bonding; precipitation hardening; multi-pass caliber-rolling; grain refinement; internal-variable theory; Ti-6Al-4V; Al 2017 alloy; Al2O3 particulate reinforcement; fatigue crack growth; equal-channel angular pressing (ECAP); severe plastic deformation; high pressure torsion; fatigue; carbide morphology; shear bands; high strength steels; microstructure; fracture surface; grain size gradient; surface mechanical attrition treatment; cryogenic; ultrafine-grained; severe plastic deformation; titanium; equal channel angular extrusion/pressing; high temperature; ultra-fine grained; Johnson-Cook model; Al alloy; severe plastic deformation; equal channel angular pressing-Conform; ultrafine grained structure; aging; strength; electrical conductivity; n/a
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