Frontiers in Ultra-Precision Machining

doi:10.3390/books978-3-0365-3863-1

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Frontiers in Ultra-Precision Machining

Edited by

April 2022

246 pages

ISBN978-3-0365-3864-8 (Hardback)
ISBN978-3-0365-3863-1 (PDF)

https://doi.org/10.3390/books978-3-0365-3863-1

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This book is a reprint of the Special Issue Frontiers in Ultra-Precision Machining that was published in

Chemistry & Materials Science

Engineering

Physical Sciences

Summary

Ultra-precision machining is a multi-disciplinary research area that is an important branch of manufacturing technology. It targets achieving ultra-precision form or surface roughness accuracy, forming the backbone and support of today’s innovative technology industries in aerospace, semiconductors, optics, telecommunications, energy, etc. The increasing demand for components with ultra-precision accuracy has stimulated the development of ultra-precision machining technology in recent decades. Accordingly, this Special Issue includes reviews and regular research papers on the frontiers of ultra-precision machining and will serve as a platform for the communication of the latest development and innovations of ultra-precision machining technologies.

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Hardback

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Keywords

fused silica; small-scale damage; magnetorheological removing method; combined repairing process; evolution law; diamond grinding; single crystal silicon; subsurface damage; crystal orientation; spherical shell; thin-walled part; wall-thickness; benchmark coincidence; data processing; ultra-precision machining; computer-controlled optical surfacing; dwell time algorithm; removal function; elementary approximation; atmospheric pressure plasma jet; continuous phase plate; surface topography; high accuracy and efficiency; polar microstructures; optimization; machining parameters; ultra-precision machining; cutting strategy; flexible grinding; shear thickening fluid; cluster effect; high-shear low-pressure; aluminum; ion beam sputtering; morphology evolution; subsurface damage; molecular dynamics; electrochemical discharge machining (ECDM); material removal rate (MRR); electrode wear ratio (EWR); overcut (OC); electrical properties; tool material; diamond tool; single-point diamond turning; lubricant; ferrous metal; electrorheological polishing; polishing tool; roughness; integrated electrode; Nano-ZrO₂ ceramics; ultra-precision grinding; surface residual material; surface quality; three-dimensional surface roughness; reversal method; eccentricity; piezoelectric actuator; flange; dynamic modeling; surface characterization; cutting forces; tool servo diamond cutting; data-dependent systems; surface topography variation; ultra-precision machining; microstructured surfaces; microlens array; three-dimensional elliptical vibration cutting; piezoelectric hysteresis; Bouc–Wen model; flower pollination algorithm; dynamic switching probability strategy; parameter identification; atom probe tomography (APT); single-wedge; lift-out; focused ion beam (FIB); Al/Ni multilayers; vibration-assisted electrochemical machining (ECM); blisk; narrow channel; high aspect ratio; multi-physics coupling simulation; machining stability; n/a