Reprint
Thermal and Electro-thermal System Simulation 2020
Edited by
January 2021
310 pages
- ISBN978-3-03943-831-0 (Hardback)
- ISBN978-3-03943-832-7 (PDF)
This book is a reprint of the Special Issue Thermal and Electro-thermal System Simulation 2020 that was published in
Chemistry & Materials Science
Engineering
Environmental & Earth Sciences
Physical Sciences
Summary
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Format
- Hardback
License
© 2022 by the authors; CC BY license
Keywords
lithium-ion battery; thermal modelling; electro-thermal model; heat generation; experimental validation; thermal transient testing; non-destructive testing; thermal testability; accuracy repeatability and reproducibility of thermal measurements; thermal testing standards; 3D IC; microchannels; liquid cooling; compact thermal model; thermal simulation; hotspot; thermal-aware task scheduling; DVFS; statistical analysis; electronic packages; detailed thermal model; Joint Electron Device Engineering Council (JEDEC) metrics; thermal impedance; thermal simulation; AlGaN-GaN HEMT; TDTR; thermal conductivity; thermal interface resistance; size effect; phonon transport mechanisms; nonlinear thermal model; SPICE; pulse transformer; thermal phenomena; self-heating; modelling; measurements; BCI-DCTM; ROM; modal approach; BGA; experimental validation; module temperature; solar energy; thermal modelling; heat transfer mechanisms; power LED measurement and simulation; life testing; reliability testing; LM-80; TM-21; LED lifetime modelling; LED multi-domain modelling; Spice-like modelling of LEDs; lifetime extrapolation and modelling of LEDs; beyond CMOS; VO2; thermal-electronic circuits; electro-thermal simulation; vertical structure; power LEDs; thermal pads; thermal resistance; measurements; optical efficiency; self-heating; electronics cooling; Light-emitting diodes; power LEDs; CoB LEDs; multi-domain modeling; finite volume method; phosphor modeling; magnetic nanoparticle; microfluidics; CFD; OpenFOAM; two-phase solver; rheology; compact thermal model; LED; Delphi4LED; digital twin; digital luminaire design; computation time; Industry 4.0