The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal performances and high-temperature reliability of LED with these bonding materials have systematically compared and studied. The thermal conductivity, electrical resistivity, and mechanical property of these bonding materials were characterized. The LED module packaged with nano-Ag has a minimum working temperature of 21.5 °C. The total thermal resistance of LED packaged with nano-Ag, Au80Sn20, and SAC305 is 4.82, 7.84, and 8.75 K/W, respectively, which is 4.72, 6.14, and 7.84 K/W higher after aging for 500 h. Meanwhile, the junction temperature change of these LEDs increases from 2.33, 3.76, and 4.25 °C to 4.34, 4.81, and 6.41 °C after aging, respectively. The thermal resistance of the nano-Ag, Au80Sn20 and SAC305 layer after aging is 1.5%, 65.7%, and 151.5% higher than before aging, respectively. After aging, the LED bonded with nano-Ag has the better optical performances in spectral intensity and light output power, which indicates its excellent heat dissipation can improve the light efficiency. These results demonstrate the nano-Ag bonding material could enhance the optical-thermal performances and high-temperature reliability of high-power LED. Full article

Artificial intelligence techniques for pneumatic robot manipulators have become of deep interest in industrial applications, such as non-high voltage environments, clean operations, and high power-to-weight ratio tasks. The principal advantages of this type of actuator are the implementation of clean energies, low cost, and easy maintenance. The disadvantages of working with pneumatic actuators are that they have non-linear characteristics. This paper proposes an intelligent controller embedded in a programmable logic device to minimize the non-linearities of the air behavior into a 3-degrees-of-freedom robot with pneumatic actuators. In this case, the device is suitable due to several electric valves, direct current motors signals, automatic controllers, and several neural networks. For every degree of freedom, three neurons adjust the gains for each controller. The learning process is constantly tuning the gain value to reach the minimum of the mean square error. Results plot a more appropriate behavior for a transitive time when the neurons work with the automatic controllers with a minimum mean error of $\pm 1.2$ mm. Full article

The low–temperature poly–Si oxide (LTPO) backplane is realized by monolithically integrating low–temperature poly–Si (LTPS) and amorphous oxide semiconductor (AOS) thin–film transistors (TFTs) in the same display backplane. The LTPO–enabled dynamic refreshing rate can significantly reduce the display’s power consumption. However, the essential hydrogenation of LTPS would seriously deteriorate AOS TFTs by increasing the population of channel defects and carriers. Hydrogen (H) diffusion barriers were comparatively investigated to reduce the H content in amorphous indium–gallium–zinc oxide (a–IGZO). Moreover, the intrinsic H–resistance of a–IGZO was impressively enhanced by plasma treatments, such as fluorine and nitrous oxide. Enabled by the suppressed H conflict, a novel AOS/LTPS integration structure was tested by directly stacking the H–resistant a–IGZO on poly–Si TFT, dubbed metal–oxide–on–Si (MOOS). The noticeably shrunken layout footprint could support much higher resolution and pixel density for next–generation displays, especially AR and VR displays. Compared to the conventional LTPO circuits, the more compact MOOS circuits exhibited similar characteristics. Full article

For new medical β titanium implants, the surface micro texture processing technology is a difficult problem. To solve this problem, a new method of ultrasonic elliptical vibration cutting (UEVC) is adopted in this paper. The mechanism of material removal in ultrasonic elliptical vibration cutting is explored for different cutting paths. By means of simulation and experimentation, the material removal mechanism of ultrasonic elliptical vibration cutting medical β titanium alloy is revealed with respect to the aspects of cutting deformation, stress distribution, force and thermal variation, and chip formation mechanism. The results show that: (1) The cutting temperature and cutting force in the UEVC process obey the law of periodic change, and the maximum point of cutting force appears ahead of the maximum point of cutting temperature. (2) The material removal process of UEVC is a “press–shear–pull” composite cutting process. The tool squeezes the material to form the chips. Under the action of high temperature, the material is removed by adiabatic shear. (3) The difference of UEVC paths will affect the removal mode of materials and form different surface morphology. (4) For different cutting paths, compressive stress is distributed at the lowest point of the machining pit, and tensile stress is distributed at the protrusion position. Full article

Single-molecule techniques have shifted the paradigm of biological measurements from ensemble measurements to probing individual molecules and propelled a rapid revolution in related fields. Compared to ensemble measurements of biomolecules, single-molecule techniques provide a breadth of information with a high spatial and temporal resolution at the molecular level. Usually, optical and electrical methods are two commonly employed methods for probing single molecules, and some platforms even offer the integration of these two methods such as optofluidics. The recent spark in technological advancement and the tremendous leap in fabrication techniques, microfluidics, and integrated optofluidics are paving the way toward low cost, chip-scale, portable, and point-of-care diagnostic and single-molecule analysis tools. This review provides the fundamentals and overview of commonly employed single-molecule methods including optical methods, electrical methods, force-based methods, combinatorial integrated methods, etc. In most single-molecule experiments, the ability to manipulate and exercise precise control over individual molecules plays a vital role, which sometimes defines the capabilities and limits of the operation. This review discusses different manipulation techniques including sorting and trapping individual particles. An insight into the control of single molecules is provided that mainly discusses the recent development of electrical control over single molecules. Overall, this review is designed to provide the fundamentals and recent advancements in different single-molecule techniques and their applications, with a special focus on the detection, manipulation, and control of single molecules on chip-scale devices. Full article

Vacuum equipment has a wide range of applications, and vacuum monitoring in such equipment is necessary in order to meet practical applications. Pirani sensors work by using the effect of air density on the heat conduction of the gas to cause temperature changes in sensitive structures, thus detecting the pressure in the surrounding environment and thus vacuum monitoring. In past decades, MEMS Pirani sensors have received considerable attention and practical applications because of their advances in simple structures, long service life, wide measurement range and high sensitivity. This review systematically summarizes and compares different types of MEMS Pirani sensors. The configuration, material, mechanism, and performance of different types of MEMS Pirani sensors are discussed, including the ones based on thermistors, thermocouples, diodes and surface acoustic wave. Further, the development status of novel Pirani sensors based on functional materials such as nanoporous materials, carbon nanotubes and graphene are investigated, and the possible future development directions for MEMS Pirani sensors are discussed. This review is with the purpose to focus on a generalized knowledge of MEMS Pirani sensors, thus inspiring the investigations on their practical applications. Full article

Although mesoporous silica materials have been widely investigated for many applications, most silica materials are made by calcination processes. We successfully developed a convenient method to synthesize mesoporous materials at room temperature. Although the silica materials made by the two different methods, which are the calcination process and the room-temperature process, have similar specific surface areas, the silica materials produced with the room-temperature process have a significantly larger pore volume. This larger pore volume has the potential to attach to functional groups that can be applied to various industrial fields such as CO₂ adsorption. This mesoporous silica with a larger pore volume was analyzed by TEM, FT-IR, low angle X-ray diffraction, N₂-adsorption analysis, and CO₂ adsorption experiments in comparison with the mesoporous silica synthesized with the traditional calcination method. Full article

A robotic system for the automatic wire pulling of coreless motor winding is designed, including the design of an opening-closing control system and a micro-gripper’s tip structure with a double-armed elastic-beam structure for the support part and an enveloping clamping structure for the tip part. The micro-gripper captures the electrode wire from the root, encircles the wire after the envelope region is closed, and the thin and flexible electrode wire is pulled to the top of the electrode pad by the movement of the micro-gripper and released. The mechanical index of the micro-gripper is simulated to obtain the optimal structural parameters. The experimental results show that the electrode wire’s maximum bearing force is about 0.3 N. Under this reaction force, the deformation of the tip-envelope region of the micro-gripper is about 27.5 μm, which is sufficient for electrode wire pulling micro-manipulation. By comparison with the steel micro-gripper, the silicon micro-gripper has more advantages in shape integrity, machinability and mechanical properties. Full article

Free-form microhemispherical shell resonators have the advantages of high quality factor and mass production. The shape of microhemispherical shells created via this process is based on a single mold and is difficult to adjust, which affects the resonant frequency and quality factor. In this paper, a process analysis model is established through in-depth analysis of the process mechanism and flow of the free-forming method. Based on this model, the influence of the designed preforming parameters on the shape, resonant frequency and thermoelastic dissipation of the microhemispherical shell are analyzed in detail, providing theoretical guidance for parameter design. The results show that the depth and the ratio of internal to external pressure of the substrate’s annular groove affect the height and thickness of the microhemispherical shell, and the structural thickness affects the thickness of the microhemispherical shell; these in turn affect the resonant frequency and thermoelastic dissipation of the microhemispherical shell resonator. In addition, the inner diameter of the substrate’s annular groove mainly affects the radius of the support column of the microhemispherical shell, and the influence on the resonant frequency and thermoelastic dissipation of the resonator is relatively low. Full article

The effect of displacement defect on SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) due to radiation is investigated using technology computer-aided design (TCAD) simulation. The position, energy level, and concentration of the displacement defect are considered as variables. The transfer characteristics, breakdown voltage, and energy loss of a double-pulse switching test circuit are analyzed. Compared with the shallow defect energy level, the deepest defect energy level with E_C − 1.55 eV exhibits considerable degradation. The on-current decreases by 54% and on-resistance increases by 293% due to the displacement defect generated at the parasitic junction field-effect transistor (JFET) region next to the P-well. Due to the existence of a defect in the drift region, the breakdown voltage increased up to 21 V. In the double-pulse switching test, the impact of displacement defect on the power loss of SiC MOSFETs is negligible. Full article

Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders, the electronics industry has turned to lead-free solders, such as ternary alloy Sn-3Ag-0.5Cu (SAC305). As lead-free solders exhibit visco-plastic mechanical properties significantly affected by temperature, their thermo-mechanical reliability has received considerable attention. In this study, the interface delamination of an SMT solder joint using a SAC305 alloy under temperature cycling has been analyzed by the nonlinear finite element method. The results indicate that the highest contact pressure at the four corners of the termination/solder horizontal interface means that delamination is most likely to occur, followed by the y-direction side region of the solder/land interface and the top arc region of the termination/solder vertical interface. It should be noted that in order to keep the shape of the solder joint in the finite element model consistent with the actual situation after the reflow process, a minimum energy-based morphology evolution method has been incorporated into the established finite element model. Eventually, an Improved Efficient Global Optimization (IEGO) method was used to optimize the geometry of the SMT solder joint in order to reduce the contact pressure at critical points and critical regions. The optimization result shows that the contact pressure at the critical points and at the critical regions decreases significantly, which also means that the probability of thermal-induced delamination decreases. Full article

N, S-doped ultramicroporous carbons (NSUC-x) with a high nitrogen/sulfur content and a narrow pore-size distribution of around 0.55 nm were firstly prepared using L-cysteine as a nitrogen and sulfur source. The phase, graphitization degree, morphology, specific surface area, pore structure and surface condition of NSUC-x are investigated to analyze the key role in electrochemical performance. Such an ultramicroporous structure and N, S doping not merely provide a high-specific surface area and a suitable pore size, but also induce a good wettability for the fast transport and adsorption of electrolyte ions. Due to the above strategies, the typical NSUC-0.4 exhibits a high gravimetric capacitance of 339 F g⁻¹ at 0.5 A g⁻¹ as well as a capacity retention of 91.6% after 10,000 cycles in a three-electrode system using a 6 M KOH electrolyte. More attractively, a NSUC-0.4-assembled symmetrical supercapacitor delivers an energy output of 7.4 Wh kg⁻¹ at 100 W kg⁻¹ in 6 M KOH as well as a capacity retention of 92.4% after 10,000 cycles, indicating its practical application prospect. Our findings open up new prospects for the design and electrochemical application of N, S-doped ultramicroporous carbons. Full article

The fluidic barrier in centrifugal microfluidic platforms is a newly introduced concept for making multiple emulsions and microparticles. In this study, we focused on particle generation application to better characterize this method. Because the phenomenon is too fast to be captured experimentally, we employ theoretical models to show how liquid polymeric droplets pass a fluidic barrier before crosslinking. We explain how secondary flows evolve and mix the fluids within the droplets. From an experimental point of view, the effect of different parameters, such as the barrier length, source channel width, and rotational speed, on the particles’ size and aspect ratio are investigated. It is demonstrated that the barrier length does not affect the particle’s ultimate velocity. Unlike conventional air gaps, the barrier length does not significantly affect the aspect ratio of the produced microparticles. Eventually, we broaden this concept to two source fluids and study the importance of source channel geometry, barrier length, and rotational speed in generating two-fluid droplets. Full article

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80 °C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder. Full article

This paper presents a novel microfluidic chip for upconcentration of sub–100 nm nanoparticles in a flow using electrical forces generated by a DC or AC field. Two electrode designs were optimized using COMSOL Multiphysics and tested using particles with sizes as low as 47 nm. We show how inclined electrodes with a zig-zag three-tooth configuration in a channel of 20 µm width are the ones generating the highest gradient and therefore the largest force. The design, based on AC dielectrophoresis, was shown to upconcentrate sub–100 nm particles by a factor of 11 using a flow rate of 2–25 µL/h. We present theoretical and experimental results and discuss how the chip design can easily be massively parallelized in order to increase throughput by a factor of at least 1250. Full article